Xiumin Zhang , Yuxi Zhao , Huanxiong Xia , Xiaohui Ao , Jianhua Liu , Jiechen Zhou , Yuhe Wang
{"title":"Modeling of curing and post-curing kinetics for a thermoset adhesive","authors":"Xiumin Zhang , Yuxi Zhao , Huanxiong Xia , Xiaohui Ao , Jianhua Liu , Jiechen Zhou , Yuhe Wang","doi":"10.1016/j.tca.2024.179745","DOIUrl":null,"url":null,"abstract":"<div><p>The properties of adhesives cured at low temperatures are often significantly affected by post-curing effects. This paper introduces a method to model both the curing and post-curing kinetics for thermoset adhesives. The total and residual enthalpies and the glass-transition temperature (<em>T</em><sub>g</sub>) of the adhesive were measured via differential scanning calorimetry. The obtained degree of cure (DOC) and <em>T</em><sub>g</sub> were then fitted to determine their functional relationship. Low-temperature curing experiments were conducted, and an <em>n</em>th-order curing kinetics equation was developed through the fitting of data. Post-curing experiments were performed on samples with varying initial DOCs, and the resulting post-curing data were normalized and fitted using an <em>n</em>th-order model. The relationships between the kinetic parameters and the initial DOC, post-curing temperature and time were analyzed, and a comprehensive kinetics model crossing the curing and post-curing stages was successfully established. Model validation was carried out, and the results demonstrated a good predictive capability.</p></div>","PeriodicalId":23058,"journal":{"name":"Thermochimica Acta","volume":null,"pages":null},"PeriodicalIF":3.1000,"publicationDate":"2024-04-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thermochimica Acta","FirstCategoryId":"92","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0040603124000844","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, ANALYTICAL","Score":null,"Total":0}
引用次数: 0
Abstract
The properties of adhesives cured at low temperatures are often significantly affected by post-curing effects. This paper introduces a method to model both the curing and post-curing kinetics for thermoset adhesives. The total and residual enthalpies and the glass-transition temperature (Tg) of the adhesive were measured via differential scanning calorimetry. The obtained degree of cure (DOC) and Tg were then fitted to determine their functional relationship. Low-temperature curing experiments were conducted, and an nth-order curing kinetics equation was developed through the fitting of data. Post-curing experiments were performed on samples with varying initial DOCs, and the resulting post-curing data were normalized and fitted using an nth-order model. The relationships between the kinetic parameters and the initial DOC, post-curing temperature and time were analyzed, and a comprehensive kinetics model crossing the curing and post-curing stages was successfully established. Model validation was carried out, and the results demonstrated a good predictive capability.
期刊介绍：
Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application.
The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta.
The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas:
- New and improved instrumentation and methods
- Thermal properties and behavior of materials
- Kinetics of thermally stimulated processes
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