{"title":"An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints","authors":"Yang Liu, Xin Xu, Yuxiong Xue, Chaoyang Xing","doi":"10.1080/01694243.2024.2336177","DOIUrl":null,"url":null,"abstract":"As the current density increases in electronic devices, electromigration has become a significant factor affecting the reliability of solder joints. In this study, the electromigration characterist...","PeriodicalId":14789,"journal":{"name":"Journal of Adhesion Science and Technology","volume":"33 1","pages":""},"PeriodicalIF":2.7000,"publicationDate":"2024-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Adhesion Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/01694243.2024.2336177","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, CHEMICAL","Score":null,"Total":0}
引用次数: 0
Abstract
As the current density increases in electronic devices, electromigration has become a significant factor affecting the reliability of solder joints. In this study, the electromigration characterist...
期刊介绍：
Journal of Adhesion Science and Technology ( JAST) provides a forum for the basic and applied aspects of adhesion, chemistry of adhesives, coatings and sealants, and structure-properties relationships in adhesive joints and deals with applications of adhesion principles in all areas of technology.
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