Jorge Pereira, Inês S. Garcia, Gabriel Ribeiro, José Fernandes, Filipe S. Alves, Marco Martins, André Cardoso, Rosana A. Dias
{"title":"Small Footprint Temperature Sensing NFC Tag","authors":"Jorge Pereira, Inês S. Garcia, Gabriel Ribeiro, José Fernandes, Filipe S. Alves, Marco Martins, André Cardoso, Rosana A. Dias","doi":"10.3390/proceedings2024097182","DOIUrl":null,"url":null,"abstract":": Smart NFC tags are seeing many interesting applications and can benefit from further miniaturization. A passive temperature sensing tag with 5.1 mm diameter is demonstrated, comprising a thin-film microfabricated antenna and an NFC chip. The microantenna/coil comprises two 15 µ m-thick electroplated copper layers embedded in SU-8, withstanding the soldering process of a BGA NFC IC. The µ -antenna design challenge is to miniaturize while minimizing performance impairment (inductive-coupling distance), while the micromachining process is very dependent on topography propagation. Fabricated coils were successfully characterized (2.32 µ H inductance; 13.76 MHz self-resonance) and temperature was read (after assembly) with a mobile phone at distances of up to 7 mm.","PeriodicalId":517679,"journal":{"name":"Eurosensors 2023","volume":"23 26","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Eurosensors 2023","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/proceedings2024097182","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
: Smart NFC tags are seeing many interesting applications and can benefit from further miniaturization. A passive temperature sensing tag with 5.1 mm diameter is demonstrated, comprising a thin-film microfabricated antenna and an NFC chip. The microantenna/coil comprises two 15 µ m-thick electroplated copper layers embedded in SU-8, withstanding the soldering process of a BGA NFC IC. The µ -antenna design challenge is to miniaturize while minimizing performance impairment (inductive-coupling distance), while the micromachining process is very dependent on topography propagation. Fabricated coils were successfully characterized (2.32 µ H inductance; 13.76 MHz self-resonance) and temperature was read (after assembly) with a mobile phone at distances of up to 7 mm.
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