Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation
{"title":"Effects of Hydrogen Peroxide on Chemical Mechanical Polishing of Copper Surface: Exploration of Reaction Pathways with Molecular Dynamics Simulation and Activation Energies Calculation","authors":"Hitomi Takahashi, Satoyuki Nomura","doi":"10.2474/trol.19.194","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":23314,"journal":{"name":"Tribology Online","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2024-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Tribology Online","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2474/trol.19.194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}