{"title":"Microstructure and properties of Cu/Si composites for electronic packaging: Effect of tungsten layer on silicon particles","authors":"Zhiyong Cai, Jing Wen, Ri-chu Wang, Yan Feng, Xiang Peng, Xinxing Li, Ziming Li, Zhijie Kang, Xiaodi Zhang","doi":"10.1016/j.jallcom.2024.174847","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":503788,"journal":{"name":"Journal of Alloys and Compounds","volume":"33 2","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Alloys and Compounds","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.jallcom.2024.174847","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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