Preparation of Ultra-thin Copper Foil with Low Profile and High Tensile Strength on Surface of 18-µm Carrier Copper Foil

IF 1.6 4区 材料科学 Q2 Materials Science Transactions of The Indian Institute of Metals Pub Date : 2024-05-20 DOI:10.1007/s12666-024-03337-5
Yao Liu, Ning Song, Xiaowei Fan, Binghu Lu, Dashuang Li, Lijuan Wang, Zhen Sun, Yunzhi Tang
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来源期刊
Transactions of The Indian Institute of Metals
Transactions of The Indian Institute of Metals Materials Science-Metals and Alloys
CiteScore
2.60
自引率
6.20%
发文量
3
期刊介绍: Transactions of the Indian Institute of Metals publishes original research articles and reviews on ferrous and non-ferrous process metallurgy, structural and functional materials development, physical, chemical and mechanical metallurgy, welding science and technology, metal forming, particulate technologies, surface engineering, characterization of materials, thermodynamics and kinetics, materials modelling and other allied branches of Metallurgy and Materials Engineering. Transactions of the Indian Institute of Metals also serves as a forum for rapid publication of recent advances in all the branches of Metallurgy and Materials Engineering. The technical content of the journal is scrutinized by the Editorial Board composed of experts from various disciplines of Metallurgy and Materials Engineering. Editorial Advisory Board provides valuable advice on technical matters related to the publication of Transactions.
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