Reduction of experimental efforts for predicting milling stability affected by concept drift using transfer learning on multiple machine tools

IF 3.6 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.04.084
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Abstract

Due to complex interrelations between the characteristics of the machine tool, spindle, tool wear and the stability of milling processes, the design of stable machining operations is challenging. Concept drift resulting from, e.g., tool wear and different dynamic behaviours often require fundamental experimental investigations on each machining centre. This paper presents a methodology for modelling process characteristics with respect to resource constraints by transferring insights from extensive experiments conducted on a reference machine to other machine tools in a process-informed manner. This methodology was exemplarily applied to predict wear-dependent process stabilities with a significantly reduced number of required cutting tests.

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利用多台机床上的迁移学习,减少预测受概念漂移影响的铣削稳定性的实验工作量
由于机床、主轴、刀具磨损和铣削加工稳定性之间存在复杂的相互关系,因此设计稳定的加工操作极具挑战性。由于刀具磨损和不同的动态行为等原因造成的概念漂移往往需要对每个加工中心进行基本的实验研究。本文介绍了一种方法,通过将在参考机床上进行的大量实验所得出的结论,以过程知情的方式转移到其他机床上,从而根据资源约束条件对过程特性进行建模。该方法被广泛应用于预测磨损相关的工艺稳定性,大大减少了所需的切削试验次数。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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