Pre-programing the glass transition temperature and transformation strain of shape memory polymers in fused deposition modeling process

IF 3.6 3区 工程技术 Q2 ENGINEERING, INDUSTRIAL Cirp Annals-Manufacturing Technology Pub Date : 2024-01-01 DOI:10.1016/j.cirp.2024.04.067
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Abstract

Shape memory polymer (SMP) parts printed with a fused deposition modeling process are increasingly considered for diverse industrial applications. However, gaps in the current understanding of how the process informs shape memory behaviors limit their applicability. This work studies how the coupled process thermomechanics, obtained at different process parameter settings such as of extrusion temperatures, influences shape memory behaviors. The results show that the process can precisely adjust the glass transition temperature within 42–50 °C and strains within 2.9–14.3% range without compromising mechanical strength. This allows imparting of multiple shape memory properties into printed SMP parts to realize complex shape-morphing behaviors.

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在熔融沉积建模过程中对形状记忆聚合物的玻璃化转变温度和转变应变进行预编程
采用熔融沉积建模工艺打印的形状记忆聚合物(SMP)部件越来越多地被考虑用于各种工业应用。然而,目前对工艺如何影响形状记忆行为的理解存在差距,这限制了其适用性。这项工作研究了在不同工艺参数设置(如挤压温度)下获得的耦合工艺热力学如何影响形状记忆行为。结果表明,在不影响机械强度的情况下,该工艺可在 42-50 °C 范围内精确调节玻璃化转变温度,并在 2.9-14.3% 范围内调节应变。这就允许在印刷 SMP 部件中赋予多种形状记忆特性,以实现复杂的形状变形行为。
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来源期刊
Cirp Annals-Manufacturing Technology
Cirp Annals-Manufacturing Technology 工程技术-工程:工业
CiteScore
7.50
自引率
9.80%
发文量
137
审稿时长
13.5 months
期刊介绍: CIRP, The International Academy for Production Engineering, was founded in 1951 to promote, by scientific research, the development of all aspects of manufacturing technology covering the optimization, control and management of processes, machines and systems. This biannual ISI cited journal contains approximately 140 refereed technical and keynote papers. Subject areas covered include: Assembly, Cutting, Design, Electro-Physical and Chemical Processes, Forming, Abrasive processes, Surfaces, Machines, Production Systems and Organizations, Precision Engineering and Metrology, Life-Cycle Engineering, Microsystems Technology (MST), Nanotechnology.
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