High-density implantable neural electrodes and chips for massive neural recordings

Brain-X Pub Date : 2024-06-20 DOI:10.1002/brx2.65
Longchun Wang, Yanxing Suo, Jiahao Wang, Xuanqi Wang, Kai Xue, Jingjing An, Xun Sun, Qinyu Chen, Xiaochen Tang, Yang Zhao, Bowen Ji, Jingquan Liu
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Abstract

High-density neural recordings with superior spatiotemporal resolution powerfully unveil cellular-scale neural communication, showing great promise in neural science, translational medicine, and clinical applications. To achieve such, many design and fabrication innovations enhanced the electrode, chip, or both for biocompatibility improvement, electrical performance upgrade, and size miniaturization, offering several thousands of recording sites. However, an enormous gap exists along the trajectory toward billions of recording sites for brain scale resolution, posing many more design challenges. This review tries to find possible insight into mitigating the gap by discussing the latest progress in high-density electrodes and chips for neural recordings. It emphasizes the design, fabrication, bonding techniques, and in vivo performance optimization of high-density electrodes. It discusses the promising opportunities for circuit-level and architecture-level multi-channel chip design innovations. We expect that joint effort and close collaboration between high-density electrodes and chips will pave the way to high-resolution neural recording tools supporting cutting-edge neuroscience discoveries and applications.

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用于大规模神经记录的高密度植入式神经电极和芯片
高密度神经记录具有卓越的时空分辨率,能有力地揭示细胞尺度的神经通信,在神经科学、转化医学和临床应用中大有可为。为了实现这一目标,许多设计和制造创新都对电极、芯片或两者进行了改进,以改善生物相容性、提高电学性能和实现尺寸微型化,从而提供数千个记录点。然而,在实现大脑尺度分辨率的数十亿个记录点的道路上,还存在着巨大的差距,这给设计带来了更多的挑战。本综述试图通过讨论用于神经记录的高密度电极和芯片的最新进展,找到缩小差距的可能方法。它强调了高密度电极的设计、制造、接合技术和体内性能优化。报告还讨论了电路级和架构级多通道芯片设计创新的大好机会。我们期待高密度电极和芯片之间的共同努力和紧密合作将为高分辨率神经记录工具铺平道路,支持神经科学的前沿发现和应用。
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