Micromechanical piezoelectric micromachined ultrasonic transducer array package enhancement with integrated frontliners

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2024-06-26 DOI:10.1088/1361-6439/ad5a18
Hongxiang Shu, Weiliang Ji, Xiangyu Sun, Zhanqiang Xing and Xu He
{"title":"Micromechanical piezoelectric micromachined ultrasonic transducer array package enhancement with integrated frontliners","authors":"Hongxiang Shu, Weiliang Ji, Xiangyu Sun, Zhanqiang Xing and Xu He","doi":"10.1088/1361-6439/ad5a18","DOIUrl":null,"url":null,"abstract":"In order to improve the susceptibility of ultrasonic transducers to damage and the mismatch in acoustic impedance with test specimens, an impedance-matching layer is introduced between the transducer and the specimen. The impact of the matching layer on acoustic propagation of transducer was analyzed through acoustic field simulation. The performance of the improved transducer was experimentally evaluated by using a dedicated echo testing system for transducers. The matching layer was optimized by considering different materials. The results show that for non-metallic materials, only a layer of acoustic matching layer (organic silicone gel) can be added to achieve acoustic impedance matching and avoid wear. For metal materials, two acoustic matching layers (organic silicone gel and epoxy resin) need to be added to achieve acoustic impedance matching. The propagation efficiency of sound waves is increased by 30% as a result of this process.","PeriodicalId":16346,"journal":{"name":"Journal of Micromechanics and Microengineering","volume":"11 1","pages":""},"PeriodicalIF":2.4000,"publicationDate":"2024-06-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Micromechanics and Microengineering","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6439/ad5a18","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

In order to improve the susceptibility of ultrasonic transducers to damage and the mismatch in acoustic impedance with test specimens, an impedance-matching layer is introduced between the transducer and the specimen. The impact of the matching layer on acoustic propagation of transducer was analyzed through acoustic field simulation. The performance of the improved transducer was experimentally evaluated by using a dedicated echo testing system for transducers. The matching layer was optimized by considering different materials. The results show that for non-metallic materials, only a layer of acoustic matching layer (organic silicone gel) can be added to achieve acoustic impedance matching and avoid wear. For metal materials, two acoustic matching layers (organic silicone gel and epoxy resin) need to be added to achieve acoustic impedance matching. The propagation efficiency of sound waves is increased by 30% as a result of this process.
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利用集成前沿增强微机械压电微机械超声波换能器阵列封装
为了改善超声波换能器对损坏的敏感性以及与测试试样之间的声阻抗失配,在换能器和试样之间引入了阻抗匹配层。通过声场模拟分析了匹配层对换能器声波传播的影响。使用传感器专用回声测试系统对改进后的传感器性能进行了实验评估。通过考虑不同的材料,对匹配层进行了优化。结果表明,对于非金属材料,只需添加一层声学匹配层(有机硅胶)即可实现声阻抗匹配并避免磨损。对于金属材料,需要添加两层声学匹配层(有机硅凝胶和环氧树脂)才能实现声阻抗匹配。通过这一工艺,声波的传播效率可提高 30%。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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