{"title":"Surface Interaction and Wear due to Sliding Electrical Contact of Materials","authors":"Xiaoman Wang, Q.Jane Wang, W.Wayne Chen, Yip-Wah Chung, Hirotaka Miwa, Toshikazu Nanbu, Yoshitaka Uehara, YuanYuan, Shuangbiao Liu, Dong Zhu","doi":"10.1080/10402004.2024.2369208","DOIUrl":null,"url":null,"abstract":"This paper reports a research study on sliding-electrical contacts of copper-diamond materials, involving modeling and validation, contact status simulations, and parametric studies. The simulation...","PeriodicalId":2,"journal":{"name":"ACS Applied Bio Materials","volume":null,"pages":null},"PeriodicalIF":4.6000,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Bio Materials","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1080/10402004.2024.2369208","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, BIOMATERIALS","Score":null,"Total":0}
引用次数: 0
Abstract
This paper reports a research study on sliding-electrical contacts of copper-diamond materials, involving modeling and validation, contact status simulations, and parametric studies. The simulation...
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