Manufacturing fused silica hemispherical resonators using polymer glass suspension and replication molding

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2024-07-09 DOI:10.1088/1361-6439/ad5b6a
Yahya Atwa, Hamza Shakeel
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Abstract

This work introduces a new method for manufacturing fused silica (FS)-based hemispherical resonators (HSRs) using a printable polymer glass mixture and replication molding. This process involves 3D printing to create the mold, followed by the casting of a photo-reactive pre-polymer glass mixture. This technique allows us to produce complex 3D geometries and offers faster production of resonators compared to other traditional methods. In this study, we manufactured three devices and successfully identified resonance modes with two (N = 2), three (N = 3) and four (N = 4) nodes/antinodes in all three HSRs, demonstrating the repeatability of our new manufacturing method. The highest quality factor of 482 k was achieved for the N = 3 resonance mode using the ring-down method. Some of the key advantages of our method include producing multiple devices efficiently with relatively good surface quality, making it a viable option for producing high-precision devices in the future. Our new fabrication technique results in a device surface roughness of ∼100 nm (measured over an area of 250 μm × 250 μm) and manufacturing yield of over 90%. Moreover, all the steps involved in this method can be completed outside of a specialized cleanroom environment.
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利用聚合物玻璃悬浮液和复制成型技术制造熔融石英半球形谐振器
这项研究介绍了一种利用可打印聚合物玻璃混合物和复制成型制造基于熔融石英(FS)的半球形谐振器(HSR)的新方法。该工艺包括先用三维打印技术制作模具,然后浇铸光反应预聚合物玻璃混合物。与其他传统方法相比,这种技术使我们能够制造出复杂的三维几何形状,并能更快地生产出谐振器。在这项研究中,我们制造了三个装置,并在所有三个 HSR 中成功识别了两个(N = 2)、三个(N = 3)和四个(N = 4)节点/阳极的共振模式,证明了我们新制造方法的可重复性。在 N = 3 谐振模式下,采用环降法获得了 482 k 的最高品质因数。我们的方法的一些主要优势包括能高效生产多个器件,且表面质量相对较好,这使其成为未来生产高精度器件的可行选择。我们的新制造技术可使器件表面粗糙度达到 ∼100 nm(测量面积为 250 μm × 250 μm),制造良率超过 90%。此外,这种方法所涉及的所有步骤都可以在专门的无尘室环境之外完成。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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