Design and analysis of dual working area micro-hotplate based on thermal crosstalk

Youpeng Yang, Guangfen Wei, Shasha Jiao, Aixiang He, and Zhonghai Lin
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Abstract

Micro-hotplates have provided the possibilities of miniaturization, low power consumption, and high integration for widespread application in MEMS sensors, such as the MEMS-based metal oxide gas sensors. However, thermal crosstalk among micro-heating areas has greatly restricted the design of a micro-hotplate. Although the issue of thermal crosstalk is annoying between independent working areas, it can reduce power consumption to a certain extent. This paper proposed a dual working area micro-hotplate based on thermal crosstalk through the foundation of an electro-thermal analysis model. It especially proposes a strategy of introducing optimized parameters from a single working area to a dual working area. Besides, evaluation for thermal crosstalk was achieved by setting the temperature of one working area as constant and monitoring the power of the other working area when it reaches a certain temperature. The results indicated that the designed dual working area micro-hotplate can save at least a quarter of the heating power compared with the single working area micro-hotplate at the same working temperature of 300 \(^\circ \textrm{C}\) and other same parameter settings. Within the acceptable limits of mechanical deformation, the heating efficiency of the micro-hotplate is improved from 4.10 mW/(mm\(^2\).\(^\circ \textrm{C}\)) to 2.99 mW/(mm\(^2\) \(^\circ \textrm{C}\)). It was demonstrated that the introduction of thermal crosstalk can significantly reduce the power consumption of the micro-hotplate, providing a viable solution for enhancing the properties of MOX gas sensor array.

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基于热串扰的双工作区微型加热板的设计与分析
微型加热板具有微型化、低功耗和高集成度的特点,可广泛应用于 MEMS 传感器,如基于 MEMS 的金属氧化物气体传感器。然而,微加热区域之间的热串扰极大地限制了微加热板的设计。虽然独立工作区之间的热串扰问题令人烦恼,但它能在一定程度上降低功耗。本文在电热分析模型的基础上,提出了一种基于热串扰的双工作区微型加热板。它特别提出了将单工作区的优化参数引入双工作区的策略。此外,还通过设定一个工作区的温度为恒定值,并监测另一个工作区达到一定温度时的功率,实现了对热串扰的评估。结果表明,在工作温度为 300 \(^\circ \textrm{C}\)和其他参数设置相同的情况下,所设计的双工作区微热板比单工作区微热板至少能节省四分之一的加热功率。在机械变形可接受的范围内,微热板的加热效率从 4.10 mW/(mm\(^2\).\(^\circ \textrm{C}\))提高到 2.99 mW/(mm\(^2)\(^\circ \textrm{C}\))。研究表明,热串扰的引入可以显著降低微热板的功耗,为增强 MOX 气体传感器阵列的性能提供了可行的解决方案。
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