Antibacterial Food Packaging Containing Stably Dispersed Cu Nanoparticles Synthesized by Novel Physical Vapor Deposition Process

Sanghoon Lee, Ho Seok Lee, Seok Keun Koh
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Abstract

Polymeric materials were modified by nanoparticles on powder (NPP) facility in which metal nanoparticles (Cu, Cu/Zn alloy etc.) are formed on the surface of rotating carrier powder by using physical vapor deposition process untile the metal content reached 0.3wt.%. The polymer material with metal nanoparticles deposited on their surface through the NPP process was then added to the raw polymer material at a ratio of 1 to 9. The mixture of modified polymer powder and raw polymer powder were then processd into a film by conventional processes such as hot melting, extrusion, T-die, and antibacterial characteristics of the film were investigated. We ultimately manufactured antibacterial food package using the film and conducted preservation test for two weeks at room temperature. Since food package containing 0.03wt.% Cu nanoparticles showed over 99.9% bacteria reduction rate, it slowed down the progress of deterioration significantly compared to conventional packages. For safety evaluation, the amount of copper released out was analyzed and a cytotoxicity test was also conducted.
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采用新型物理气相沉积工艺合成的含有稳定分散的铜纳米粒子的抗菌食品包装
利用粉末上的纳米颗粒(NPP)设备对聚合物材料进行改性。在该设备中,通过物理气相沉积工艺在旋转载体粉末表面形成金属纳米颗粒(铜、铜/锌合金等),直到金属含量达到 0.3wt.%。然后将通过 NPP 工艺在表面沉积了金属纳米颗粒的聚合物材料以 1:9 的比例添加到聚合物原料中。然后将改性聚合物粉末和聚合物原料粉末的混合物通过热熔、挤出、T 型模等传统工艺加工成薄膜,并对薄膜的抗菌特性进行了研究。最终,我们用这种薄膜制造出了抗菌食品包装,并在室温下进行了为期两周的保存试验。由于含有 0.03wt.% 纳米铜粒子的食品包装的细菌减少率超过 99.9%,因此与传统包装相比,它大大减缓了食品变质的速度。在安全性评估方面,分析了铜的释放量,并进行了细胞毒性测试。
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