Design of an enhanced dual-band microstrip patch antenna with defected ground structures for WLAN and WiMax

Mohamed Lemine El Issawi, Dominic Bernard Onyango Konditi, A. D. Usman
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Abstract

This research presents an innovative dual-band microstrip patch antenna design enhanced with defected ground structures (DGS) and barium strontium titanate (BST) thin film, tailored for wireless local area network (WLAN) and WiMax applications. The first design phase involved the development of an microstrip patch antenna (MPA) using an flame retardant (FR4) substrate with a permittivity (εr1) of 4.3 and a thickness of 1.524 mm, enhanced with DGS. This configuration achieved a single-band resonance at 4.1 GHz, with a bandwidth of 0.82 GHz and a return loss (S11) of -32 dB. The second phase involved the integration of a BST thin film, with a high permittivity(εr2) of 250 and a thickoness of 0.1 mm, into the DGS-enhanced microstrip patch antenna (MPA). This mdification led to a transformation in the antenna's performance, enabling dual-band operation at resonance frequencies of 2.8 GHz and 5.8 GHz. Further, there was a corresponding substantial increase in bandwidth to 1.34 GHz and 1.25 GHz, respectively, an improvement in S11 values to -16.3 dB and -21.4 dB. Moreover, and antenna’s size of 14×10×1.524 mm3 . The study underscores the critical role of innovative material use and design optimization in advancing antenna technology, offering significant enhancements in bandwidth, and miniaturization, for wireless communication systems.
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为 WLAN 和 WiMax 设计带缺陷接地结构的增强型双频微带贴片天线
本研究提出了一种创新的双频微带贴片天线设计,采用缺陷接地结构 (DGS) 和钛酸锶钡 (BST) 薄膜进行增强,适用于无线局域网 (WLAN) 和 WiMax 应用。第一设计阶段包括开发一种微带贴片天线(MPA),使用阻燃(FR4)基板,其介电常数(εr1)为 4.3,厚度为 1.524 毫米,并使用 DGS 增强。这种配置实现了 4.1 GHz 的单频共振,带宽为 0.82 GHz,回波损耗 (S11) 为 -32 dB。第二阶段是在 DGS 增强型微带贴片天线 (MPA) 中集成 BST 薄膜,该薄膜具有 250 的高介电常数(εr2)和 0.1 毫米的厚度。这种改进使天线的性能发生了变化,实现了在 2.8 GHz 和 5.8 GHz 共振频率下的双频工作。此外,带宽也相应大幅增加到 1.34 GHz 和 1.25 GHz,S11 值分别提高到 -16.3 dB 和 -21.4 dB。此外,天线尺寸为 14×10×1.524 立方毫米。这项研究强调了创新材料的使用和设计优化在推动天线技术发展中的关键作用,可显著提高无线通信系统的带宽和小型化。
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来源期刊
CiteScore
2.90
自引率
0.00%
发文量
782
期刊介绍: The aim of Indonesian Journal of Electrical Engineering and Computer Science (formerly TELKOMNIKA Indonesian Journal of Electrical Engineering) is to publish high-quality articles dedicated to all aspects of the latest outstanding developments in the field of electrical engineering. Its scope encompasses the applications of Telecommunication and Information Technology, Applied Computing and Computer, Instrumentation and Control, Electrical (Power), Electronics Engineering and Informatics which covers, but not limited to, the following scope: Signal Processing[...] Electronics[...] Electrical[...] Telecommunication[...] Instrumentation & Control[...] Computing and Informatics[...]
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