Study on the mechanical and thermal properties of aramid fibre reinforced with sawdust particulates in an epoxy matrix composite: a novel material for structural applications

IF 2.9 4区 化学 Q2 POLYMER SCIENCE Polymer International Pub Date : 2024-07-26 DOI:10.1002/pi.6685
Thandavamoorthy Raja, Yuvarajan Devarajan
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Abstract

This study investigates the development and characterization of a novel composite material for structural applications, aiming to address the growing demand for lightweight, durable and versatile materials. The composite integrates aramid fibre reinforced with sawdust particulates within an epoxy matrix. Methodologically, the composite was fabricated using a hand layup process, ensuring even distribution and strong adhesion between components. Mechanical testing revealed significant enhancements in tensile strength (up to 135.29 MPa) and flexural strength (up to 136.92 MPa) with the inclusion of sawdust particulates, optimizing stress distribution and impact resistance. Hardness was also improved, peaking at a Rockwell hardness number of 94. Thermal analysis demonstrated moderate thermal conductivity (1.92 W mK−1) and a high heat deflection temperature (109 °C), indicating excellent thermal stability. SEM provided insights into the composite's microstructure, confirming uniform sawdust distribution and robust fibre–matrix adhesion. These findings underscore the potential of this composite for lightweight, durable and thermally stable structural applications. © 2024 Society of Chemical Industry.

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研究在环氧基复合材料中使用锯屑颗粒增强芳纶纤维的机械和热性能:一种新型结构应用材料
本研究调查了一种新型结构应用复合材料的开发和特性,旨在满足对轻质、耐用和多功能材料日益增长的需求。这种复合材料在环氧树脂基体中加入了用锯屑颗粒增强的芳纶纤维。在方法上,该复合材料采用手糊工艺制作,确保了各组分之间的均匀分布和牢固粘合。机械测试表明,加入锯屑颗粒后,拉伸强度(高达 135.29 兆帕)和抗弯强度(高达 136.92 兆帕)显著提高,应力分布和抗冲击性也得到优化。硬度也有所提高,洛氏硬度达到 94。热分析表明,该材料具有适中的热导率(1.92 W mK-1)和较高的热变形温度(109 °C),表明其具有出色的热稳定性。扫描电子显微镜可深入了解复合材料的微观结构,证实锯末分布均匀,纤维与基质之间的粘附力很强。这些发现凸显了这种复合材料在轻质、耐用和热稳定性结构应用方面的潜力。© 2024 化学工业协会。
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来源期刊
Polymer International
Polymer International 化学-高分子科学
CiteScore
7.10
自引率
3.10%
发文量
135
审稿时长
4.3 months
期刊介绍: Polymer International (PI) publishes the most significant advances in macromolecular science and technology. PI especially welcomes research papers that address applications that fall within the broad headings Energy and Electronics, Biomedical Studies, and Water, Environment and Sustainability. The Journal’s editors have identified these as the major challenges facing polymer scientists worldwide. The Journal also publishes invited Review, Mini-review and Perspective papers that address these challenges and others that may be of growing or future relevance to polymer scientists and engineers.
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