Effects of external static electrical field on thermal and electrical conductivity in the Al-Cu, Al-Ni, and Al-Si eutectic alloys

IF 3.1 2区 化学 Q2 CHEMISTRY, ANALYTICAL Thermochimica Acta Pub Date : 2024-07-18 DOI:10.1016/j.tca.2024.179828
Sercan Basit , Pınar Ata Esener , Yiğit Yavuz Aydoğan , Sezen Aksöz , Necmettin Maraşlı
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Abstract

This study aims to investigate the effects of external positive and negative static electric fields (E+ and E- respectively) on thermal conductivity (K) and electrical conductivity (σ) in Al-33 wt. % Cu, Al-6.4 wt. % Ni and Al-12 wt. % Si eutectic alloys. For this purpose, the solidifications of Al-Cu, Al-Ni, and Al-Si eutectic alloys were directionally done under E+ and E-. The directions of E were chosen to be parallel (E+) and antiparallel (E-) to the solid-liquid (S-L) growth direction and the magnitudes of E were approximately (+10) and (−10) kV cm−1 and (+16) and (-16) kV cm−1 for the Al-Cu, Al-Ni, and Al-Si eutectic alloys, respectively. The effects of E+ and E on the K and σ were determined by the longitudinal heat flow and the four-point probe methods, respectively. While the K and σ values decreased with increasing temperature, the K and σ were increased and decreased with E+ and E, respectively.

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外部静电场对铝铜、铝镍和铝硅共晶合金导热性和导电性的影响
本研究旨在探讨外部正负静态电场(分别为 E+ 和 E-)对 Al-33(重量百分比)铜、Al-6.4(重量百分比)镍和 Al-12(重量百分比)硅共晶合金的热导率(K)和电导率(σ)的影响。为此,铝-铜、铝-镍和铝-硅共晶合金在 E+ 和 E- 下定向凝固。E 的方向选择为与固液(S-L)生长方向平行(E+)和反平行(E-),对于 Al-Cu、Al-Ni 和 Al-Si 共晶合金,E 的大小分别约为 (+10) 和 (-10) kV cm-1 以及 (+16) 和 (-16) kV cm-1。E+ 和 E- 对 K 和 σ 的影响分别通过纵向热流法和四点探针法测定。虽然 K 值和σ值随温度升高而降低,但 K 值和σ值分别随 E+ 和 E- 的升高和降低而升高和降低。
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来源期刊
Thermochimica Acta
Thermochimica Acta 化学-分析化学
CiteScore
6.50
自引率
8.60%
发文量
210
审稿时长
40 days
期刊介绍: Thermochimica Acta publishes original research contributions covering all aspects of thermoanalytical and calorimetric methods and their application to experimental chemistry, physics, biology and engineering. The journal aims to span the whole range from fundamental research to practical application. The journal focuses on the research that advances physical and analytical science of thermal phenomena. Therefore, the manuscripts are expected to provide important insights into the thermal phenomena studied or to propose significant improvements of analytical or computational techniques employed in thermal studies. Manuscripts that report the results of routine thermal measurements are not suitable for publication in Thermochimica Acta. The journal particularly welcomes papers from newly emerging areas as well as from the traditional strength areas: - New and improved instrumentation and methods - Thermal properties and behavior of materials - Kinetics of thermally stimulated processes
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