Context effects on repair of 5’-overhang DSB induced by Cas12a in Arabidopsis

Sébastien Lageix, Miguel Hernandez Sanchez-Rebato, Maria E. Gallego, Jérémy Verbeke, Yannick Bidet, Sandrine Viala, Charles I. White
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Abstract

Sequence-specific endonucleases have been key to the study of the mechanisms and control of DNA double-strand break (DSB) repair and recombination and the availability of CRISPR-Cas nucleases over the last decade has driven rapid progress in understanding and application of targeted recombination in many organisms, including plants. We present here an analysis of recombination at targeted chromosomal 5’overhang DSB generated by the FnCas12a endonuclease in the plant, Arabidopsis thaliana. The much-studied Cas9 nuclease cleaves DNA to generate blunt-ended, double-strand breaks (DSB), but relatively less is known about the repair of other types of breaks, such as those with 5’-overhanging ends. Sequencing the repaired breaks clearly shows that the majority of repaired DSB carry small deletions and are thus repaired locally by End-Joining recombination, confirmed by Nanopore sequencing of larger amplicons. Paired DSB generate deletions at one or both cut-sites, as well as deletions and reinsertions of the deleted segment between the two cuts, visible as inversions. While differences are seen in the details, overall the deletion patterns are similar between repair at single-cut and double-cut events, notwithstanding the fact that only the former involve cohesive DNA overhangs. A strikingly different repair pattern is however observed at breaks flanked by direct repeats. This change in sequence context results in the presence of an alternative class of repair events, corresponding to highly efficient repair by Single-strand Annealing recombination.
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背景对拟南芥中 Cas12a 诱导的 5'-overhang DSB 修复的影响
序列特异性内切酶是研究 DNA 双链断裂(DSB)修复和重组机制与控制的关键,过去十年中 CRISPR-Cas 核酸酶的出现推动了对包括植物在内的许多生物体中靶向重组的理解和应用的快速进展。我们在本文中分析了拟南芥(Arabidopsis thaliana)中由 FnCas12a 内切酶产生的靶向染色体 5'overhang DSB 重组。人们对 Cas9 核酸内切酶切割 DNA 产生钝端双链断裂(DSB)的情况研究颇多,但对其他类型断裂(如 5'overhanging end)的修复情况了解较少。对修复的断裂进行测序清楚地表明,大多数修复的 DSB 都带有小的缺失,因此是通过末端连接重组(End-Joining recombination)进行局部修复的,较大的扩增子的 Nanopore 测序也证实了这一点。成对的 DSB 会在一个或两个切割位点产生缺失,以及在两个切割位点之间的缺失片段的缺失和再插入,表现为倒位。虽然在细节上存在差异,但总的来说,单切和双切事件的缺失修复模式是相似的,尽管只有前者涉及内聚 DNA 悬垂。然而,在断裂两侧有直接重复序列的情况下,修复模式却截然不同。序列上下文的这种变化导致了另一类修复事件的出现,即单链退火重组的高效修复。
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