Hearing Aid Silicone Impression Material Discovered During Exploration of the Middle Ear: 2 Case Reports and Literature Review.

Khalid Al Zaabi, Eiman Al-Ajmi, Mohamed Badr El-Dine
{"title":"Hearing Aid Silicone Impression Material Discovered During Exploration of the Middle Ear: 2 Case Reports and Literature Review.","authors":"Khalid Al Zaabi, Eiman Al-Ajmi, Mohamed Badr El-Dine","doi":"10.5152/iao.2024.231421","DOIUrl":null,"url":null,"abstract":"<p><p>It is unusual to see complications with the preparation of ear mold in order to get hearing aids for children who are in need. However, we came across 2 cases who had a foreign body retained in the middle ear after a long period of time from taking silicon mold impression for hearing aid fitting. One patient presented after 2 years, and the other patient presented after 10 years of hearing aid fitting. We are reporting 2 cases with silicon impression material left in the middle ear for a long period of time after taking an impression for hearing aid fitting and found unexpectedly during exploratory tympanotomy. These reported cases are among the few cases reported worldwide without clear known incidence. This necessitates proper examination by otolaryngologists and the audiologists who are responsible for taking the impression to prevent such complications.</p>","PeriodicalId":94238,"journal":{"name":"The journal of international advanced otology","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11363183/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The journal of international advanced otology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.5152/iao.2024.231421","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

It is unusual to see complications with the preparation of ear mold in order to get hearing aids for children who are in need. However, we came across 2 cases who had a foreign body retained in the middle ear after a long period of time from taking silicon mold impression for hearing aid fitting. One patient presented after 2 years, and the other patient presented after 10 years of hearing aid fitting. We are reporting 2 cases with silicon impression material left in the middle ear for a long period of time after taking an impression for hearing aid fitting and found unexpectedly during exploratory tympanotomy. These reported cases are among the few cases reported worldwide without clear known incidence. This necessitates proper examination by otolaryngologists and the audiologists who are responsible for taking the impression to prevent such complications.

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在中耳探查过程中发现的助听器硅胶印模材料:2 个病例报告和文献综述。
为有需要的儿童配戴助听器而制作耳模时出现并发症的情况并不多见。但是,我们遇到过两个病例,他们在为助听器验配而制作硅胶耳模后,经过很长一段时间,中耳内仍有异物残留。其中一名患者在验配助听器 2 年后出现异物,另一名患者在验配助听器 10 年后出现异物。我们报告了两例为助听器验配取模后硅胶印模材料长期残留在中耳内,并在鼓室切开术中意外发现的病例。这些病例是全球报告的少数病例之一,没有明确的发病率。这就要求耳鼻喉科医生和负责取印模的听力学家进行适当的检查,以防止此类并发症的发生。
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