3-D Printed All-Dielectric Ultrabroadband Microwave Absorber

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-23 DOI:10.1109/TEMC.2024.3440060
Jyoti Yadav;Rahul Vishwakarma;Mondeep Saikia;Kumar Vaibhav Srivastava;J. Ramkumar
{"title":"3-D Printed All-Dielectric Ultrabroadband Microwave Absorber","authors":"Jyoti Yadav;Rahul Vishwakarma;Mondeep Saikia;Kumar Vaibhav Srivastava;J. Ramkumar","doi":"10.1109/TEMC.2024.3440060","DOIUrl":null,"url":null,"abstract":"A dielectric resonator-based ultrabroadband microwave absorber is proposed. The first and second iterations of the Minkowski fractal are exploited to design the final unit cell geometry. The final prototype is an all-dielectric microwave absorber and is fabricated using 3-D printing technology. Conventional microwave absorbers are usually made up of metal, dielectric, resistive, or active components, while the proposed absorber is fabricated using just dielectric material, hence the name all-dielectric. This all-dielectric absorber offers absorption from 2.54–40 GHz at normal incidence. For TE mode, absorption is stable up to 40\n<inline-formula><tex-math>$^{\\circ }$</tex-math></inline-formula>\n and up to 60\n<inline-formula><tex-math>$^{\\circ }$</tex-math></inline-formula>\n for TM mode. The ultrawide band with its −10 dB fractional bandwidth up to 176\n<inline-formula><tex-math>$\\%$</tex-math></inline-formula>\n is achieved using single technology and one-step fabrication. Measurement results are in good agreement with simulation. The presented work opens new dimensions to explore all-dielectric mechanically robust microwave absorbers. Therefore, it is suitable for use in harsh environments without any post-processing treatment.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1717-1724"},"PeriodicalIF":2.5000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10645689/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

A dielectric resonator-based ultrabroadband microwave absorber is proposed. The first and second iterations of the Minkowski fractal are exploited to design the final unit cell geometry. The final prototype is an all-dielectric microwave absorber and is fabricated using 3-D printing technology. Conventional microwave absorbers are usually made up of metal, dielectric, resistive, or active components, while the proposed absorber is fabricated using just dielectric material, hence the name all-dielectric. This all-dielectric absorber offers absorption from 2.54–40 GHz at normal incidence. For TE mode, absorption is stable up to 40 $^{\circ }$ and up to 60 $^{\circ }$ for TM mode. The ultrawide band with its −10 dB fractional bandwidth up to 176 $\%$ is achieved using single technology and one-step fabrication. Measurement results are in good agreement with simulation. The presented work opens new dimensions to explore all-dielectric mechanically robust microwave absorbers. Therefore, it is suitable for use in harsh environments without any post-processing treatment.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
3-D 打印全介质超宽带微波吸收器
提出了一种基于介质谐振腔的超宽带微波吸收器。闵可夫斯基分形的第一次和第二次迭代被用来设计最终的单元几何。最终的原型是一个全介质微波吸收器,使用3d打印技术制造。传统的微波吸收器通常由金属、电介质、电阻或有源元件组成,而所提出的吸收器仅使用电介质材料制造,因此称为全电介质。这种全介电吸收器在正常入射下提供2.54-40 GHz的吸收。对于TE模式,吸收稳定到40$^{\circ}$,而对于TM模式,吸收稳定到60$^{\circ}$。使用单一技术和一步制造实现了- 10 dB分数带宽高达176美元的超宽带。测量结果与仿真结果吻合较好。所提出的工作为探索全介质机械鲁棒微波吸收器开辟了新的维度。因此适合在恶劣环境下使用,无需任何后处理处理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
期刊最新文献
Efficient Approach for Electromagnetic Radiation Sources Modeling Based on Fourier Transform of Near Magnetic Field Measurements A Phaseless Source Reconstruction Method Based on a Multipopulation Differential Evolution Algorithm With Divided Strategies and Dynamic Adjustment A Power-Sensitive Feature Index Model-Based Method for EMC Prediction of GPS Receivers Kernel-Enhanced Deep Learning for Temperature-Dependent Electromagnetic Susceptibility Modeling of Analog Sensors Blank Page
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1