{"title":"3-D Printed All-Dielectric Ultrabroadband Microwave Absorber","authors":"Jyoti Yadav;Rahul Vishwakarma;Mondeep Saikia;Kumar Vaibhav Srivastava;J. Ramkumar","doi":"10.1109/TEMC.2024.3440060","DOIUrl":null,"url":null,"abstract":"A dielectric resonator-based ultrabroadband microwave absorber is proposed. The first and second iterations of the Minkowski fractal are exploited to design the final unit cell geometry. The final prototype is an all-dielectric microwave absorber and is fabricated using 3-D printing technology. Conventional microwave absorbers are usually made up of metal, dielectric, resistive, or active components, while the proposed absorber is fabricated using just dielectric material, hence the name all-dielectric. This all-dielectric absorber offers absorption from 2.54–40 GHz at normal incidence. For TE mode, absorption is stable up to 40\n<inline-formula><tex-math>$^{\\circ }$</tex-math></inline-formula>\n and up to 60\n<inline-formula><tex-math>$^{\\circ }$</tex-math></inline-formula>\n for TM mode. The ultrawide band with its −10 dB fractional bandwidth up to 176\n<inline-formula><tex-math>$\\%$</tex-math></inline-formula>\n is achieved using single technology and one-step fabrication. Measurement results are in good agreement with simulation. The presented work opens new dimensions to explore all-dielectric mechanically robust microwave absorbers. Therefore, it is suitable for use in harsh environments without any post-processing treatment.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1717-1724"},"PeriodicalIF":2.5000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10645689/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
A dielectric resonator-based ultrabroadband microwave absorber is proposed. The first and second iterations of the Minkowski fractal are exploited to design the final unit cell geometry. The final prototype is an all-dielectric microwave absorber and is fabricated using 3-D printing technology. Conventional microwave absorbers are usually made up of metal, dielectric, resistive, or active components, while the proposed absorber is fabricated using just dielectric material, hence the name all-dielectric. This all-dielectric absorber offers absorption from 2.54–40 GHz at normal incidence. For TE mode, absorption is stable up to 40
$^{\circ }$
and up to 60
$^{\circ }$
for TM mode. The ultrawide band with its −10 dB fractional bandwidth up to 176
$\%$
is achieved using single technology and one-step fabrication. Measurement results are in good agreement with simulation. The presented work opens new dimensions to explore all-dielectric mechanically robust microwave absorbers. Therefore, it is suitable for use in harsh environments without any post-processing treatment.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.