Failure Analysis of PLCs Under High Power Electromagnetic Pulses

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-29 DOI:10.1109/TEMC.2024.3446845
Yong Li;Jianguo Wang;Haiyan Xie;Hui Yan;Feng Qin;Yayun Dong;Hailiang Qiao;Maoyu Zhang;Xinyang Zhai;Xin Nie;Wei Wang
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Abstract

In this article, the failure mechanisms of programmable logic controllers (PLCs) under high power electromagnetic pulses (HPEMPs) are studied. The vulnerable ports, failure mechanisms, and sensitive parameters are studied theoretically and numerically, and the results indicate that PLCs may be damaged under external HPEMP. Input ports are more sensitive than output ports. Three high-speed counter ports I0.3, I0.4, and I0.5 may fail under HPEMP, resulting in the failure of the PLC to operate. The front components of these input ports are vulnerable. The heat generated through an electrothermal coupling process is the main failure reason. The welding point where the top wire of the diode connected to the bulk silicon is the main heat-generating area. The bottom electrode of the diode will also generate heat, which may cause the “popcorn effect,” ultimately leading to equipment failure. The numerical and experimental results show that the failure threshold voltage follows an exponential relationship (exponent of −2) with the width under quasi-static processes.
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大功率电磁脉冲下 PLC 的故障分析
本文研究了可编程逻辑控制器(plc)在大功率电磁脉冲(HPEMPs)作用下的失效机理。对plc的脆弱端口、失效机制和敏感参数进行了理论和数值研究,结果表明plc在外部高压脉冲电场作用下可能会损坏。输入端口比输出端口更敏感。高速计数器I0.3、I0.4、I0.5在HPEMP下可能失效,导致PLC无法运行。这些输入端口的前端组件是脆弱的。通过电热耦合过程产生的热量是主要的失效原因。二极管顶部导线与体硅相连的焊接点是主要的发热区域。二极管的底部电极也会产生热量,这可能会造成“爆米花效应”,最终导致设备故障。数值和实验结果表明,在准静态过程中,失效阈值电压与宽度呈指数关系(指数为−2)。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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