Oussama Gassab;Hao Xie;Yanning Chen;Yu Zhu;Anmol Abbas Lodhi;Sichao Du;Duo Xiao;Wen-Yan Yin
{"title":"Efficient Modeling of Skin and Proximity Effects Over Ultrawide Frequency Range, Part II: Multi-Conductor Arrays and Recursive Formulas","authors":"Oussama Gassab;Hao Xie;Yanning Chen;Yu Zhu;Anmol Abbas Lodhi;Sichao Du;Duo Xiao;Wen-Yan Yin","doi":"10.1109/TEMC.2024.3437690","DOIUrl":null,"url":null,"abstract":"In Part II, both skin and proximity effects in multisolid and hollow conductor arrays are accurately predicted over an ultrawide frequency range. This is accomplished through the development of recursive formulas that consider the mutual influence among all neighboring conductors, enabling accurate prediction of the current as well as field distribution within and around each conductor. The recursive formulas are developed by considering the interaction among conductors in the array using the magnetic vector potential in a recursive way. Hence, the impact of conductor size and number on the skin and proximity effects in such array is investigated appropriately. It is numerically shown that if nearby conductors have relatively large radii with small separations, an increased number of iterations is required for achieving accurate results of both current and field distributions. Further, the transfer impedances of a shielded twinax cable situated near other shields are also predicted utilizing the recursive formulas. The proposed methodology is validated by comparing with both commercial software COMSOL and HFSS, where excellent agreements are obtained.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1490-1504"},"PeriodicalIF":2.0000,"publicationDate":"2024-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10659232/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In Part II, both skin and proximity effects in multisolid and hollow conductor arrays are accurately predicted over an ultrawide frequency range. This is accomplished through the development of recursive formulas that consider the mutual influence among all neighboring conductors, enabling accurate prediction of the current as well as field distribution within and around each conductor. The recursive formulas are developed by considering the interaction among conductors in the array using the magnetic vector potential in a recursive way. Hence, the impact of conductor size and number on the skin and proximity effects in such array is investigated appropriately. It is numerically shown that if nearby conductors have relatively large radii with small separations, an increased number of iterations is required for achieving accurate results of both current and field distributions. Further, the transfer impedances of a shielded twinax cable situated near other shields are also predicted utilizing the recursive formulas. The proposed methodology is validated by comparing with both commercial software COMSOL and HFSS, where excellent agreements are obtained.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.