Efficient Modeling of Skin and Proximity Effects Over Ultrawide Frequency Range, Part II: Multi-Conductor Arrays and Recursive Formulas

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-08-29 DOI:10.1109/TEMC.2024.3437690
Oussama Gassab;Hao Xie;Yanning Chen;Yu Zhu;Anmol Abbas Lodhi;Sichao Du;Duo Xiao;Wen-Yan Yin
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Abstract

In Part II, both skin and proximity effects in multisolid and hollow conductor arrays are accurately predicted over an ultrawide frequency range. This is accomplished through the development of recursive formulas that consider the mutual influence among all neighboring conductors, enabling accurate prediction of the current as well as field distribution within and around each conductor. The recursive formulas are developed by considering the interaction among conductors in the array using the magnetic vector potential in a recursive way. Hence, the impact of conductor size and number on the skin and proximity effects in such array is investigated appropriately. It is numerically shown that if nearby conductors have relatively large radii with small separations, an increased number of iterations is required for achieving accurate results of both current and field distributions. Further, the transfer impedances of a shielded twinax cable situated near other shields are also predicted utilizing the recursive formulas. The proposed methodology is validated by comparing with both commercial software COMSOL and HFSS, where excellent agreements are obtained.
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超宽频率范围皮肤效应和邻近效应的高效建模,第二部分:多导体阵列和递归公式
在第二部分中,对多实心和空心导体阵列的集肤效应和邻近效应进行了超宽频率范围的精确预测。这是通过开发考虑了所有相邻导体之间相互影响的递归公式来实现的,从而能够准确预测电流以及每个导体内部和周围的场分布。递归公式是通过使用磁矢量势以递归方式考虑阵列中导体之间的相互作用而开发的。因此,导体尺寸和数量对此类阵列中集肤效应和邻近效应的影响得到了适当的研究。数值结果表明,如果邻近导体的半径相对较大而间距较小,则需要增加迭代次数才能获得电流和磁场分布的精确结果。此外,还利用递归公式预测了位于其他屏蔽附近的屏蔽双轴电缆的传输阻抗。通过与商用软件 COMSOL 和 HFSS 进行比较,验证了所提出的方法,两者的结果非常吻合。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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