Bharath Antarvedi Goda , David Labonte , Mattia Bacca
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引用次数: 0
Abstract
Cutting mechanics in soft solids have been a subject of study for several decades, an interest fuelled by the multitude of its applications, including material testing, manufacturing, and biomedical technology. Wire cutting of a parallelepiped sample is the simplest model system to analyse the cutting resistance of a soft material. However, even for this simple system, the complex failure mechanisms that underpin cutting are still not completely understood. Several models that connect the critical cutting force to the radius of the wire and the key mechanical properties of the cut material have been proposed. An almost ubiquitous simplifying assumption is a state of plane (and anti-plane) strain in the material. In this paper, we show that this assumption can lead to erroneous conclusions because even such a simple cutting problem is essentially three-dimensional. A planar approximation restricts the analysis to the stress distribution in the midplane of the sample. However, through threedimensional finite element modelling, we reveal that the maximal tensile stress – and thus the likely location of cut initiation – is located in the front face of the sample (end effect). Friction reduces the magnitude of this tensile stress, but this detrimental effect can be counteracted by large “slice-to-push” (shear-to-indentation) ratios. The introduction of the “end effect” helps reconcile a recent controversy around the role of friction in wire cutting, for it implies that slicing can indeed reduce required cutting forces, but only if the slice-push ratio and the friction coefficient are sufficiently large.
期刊介绍:
Extreme Mechanics Letters (EML) enables rapid communication of research that highlights the role of mechanics in multi-disciplinary areas across materials science, physics, chemistry, biology, medicine and engineering. Emphasis is on the impact, depth and originality of new concepts, methods and observations at the forefront of applied sciences.