{"title":"Subsurface damage in sapphire ultra-precision grinding","authors":"","doi":"10.1016/j.jmapro.2024.08.056","DOIUrl":null,"url":null,"abstract":"<div><p>This work is to investigate the subsurface damage distribution law and suppression methods in sapphire ultra-precision grinding. The grinding strategies of rough grinding, semi-finish grinding and ultra-precision grinding are used to suppress the subsurface damage, the effects of grinding wheel grit size and number of grinding passes on the subsurface damage are investigated. First, cross-section polishing, FIB, and ion beam polishing were employed to reveal the scale and distribution of subsurface damage. Second, chemical etching was performed on the subsurface, the subsurface cracks with different grinding strategies were exposed, and the crack distribution density was obtained by image processing. Then, the subsurface deformation behavior and microcrack formation mechanism were investigated by TEM. The damage scales of different grinding strategies were evaluated using photothermal absorption. Ultimate, ultra-precision grinding can control the subsurface damage scale to 3.9 μm, the mechanisms of subsurface damage generation and removal were revealed. Meanwhile, a subsurface damage model more suitable for the combined grinding strategy was proposed.</p></div>","PeriodicalId":16148,"journal":{"name":"Journal of Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":6.1000,"publicationDate":"2024-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Processes","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1526612524008879","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
This work is to investigate the subsurface damage distribution law and suppression methods in sapphire ultra-precision grinding. The grinding strategies of rough grinding, semi-finish grinding and ultra-precision grinding are used to suppress the subsurface damage, the effects of grinding wheel grit size and number of grinding passes on the subsurface damage are investigated. First, cross-section polishing, FIB, and ion beam polishing were employed to reveal the scale and distribution of subsurface damage. Second, chemical etching was performed on the subsurface, the subsurface cracks with different grinding strategies were exposed, and the crack distribution density was obtained by image processing. Then, the subsurface deformation behavior and microcrack formation mechanism were investigated by TEM. The damage scales of different grinding strategies were evaluated using photothermal absorption. Ultimate, ultra-precision grinding can control the subsurface damage scale to 3.9 μm, the mechanisms of subsurface damage generation and removal were revealed. Meanwhile, a subsurface damage model more suitable for the combined grinding strategy was proposed.
期刊介绍:
The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.