Accelerate IEMI Evaluation in the Design Stage Using Parametric Vector-Fitting

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-09-11 DOI:10.1109/TEMC.2024.3453556
Mingwen Zhang;Chunguang Ma;Ruilong Song;Yong Luo
{"title":"Accelerate IEMI Evaluation in the Design Stage Using Parametric Vector-Fitting","authors":"Mingwen Zhang;Chunguang Ma;Ruilong Song;Yong Luo","doi":"10.1109/TEMC.2024.3453556","DOIUrl":null,"url":null,"abstract":"Electromagnetic interference (EMI) evaluation necessitates a crucial first step: electromagnetic (EM) coupling analysis. The field-to-line coupling problem requires a self-consistent solution of the EM problem and the associated circuit. Efficient prediction of circuit responses is paramount for statistical or parametric analysis in EMI evaluation. This article employs parametric vector-fitting (VF) to analyze the EM coupling effect on microstrip lines in a perforated metallic enclosure. The EM coupling problem is converted into a circuit using Thevenin's equivalent circuit and VF, where a rational function with a common pole represents the transfer function at various incident directions. An intentional EMI source is introduced into the circuit in this way and is treated as a load-independent source. The results obtained from equivalent circuit methods exhibit consistency with those computed by full-wave solver for linear and nonlinear loads, showcasing superior time efficiency. The application of parametric VF in field-to-line coupling can expedite EMI evaluations during the product design phase.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1868-1875"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10676322/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Electromagnetic interference (EMI) evaluation necessitates a crucial first step: electromagnetic (EM) coupling analysis. The field-to-line coupling problem requires a self-consistent solution of the EM problem and the associated circuit. Efficient prediction of circuit responses is paramount for statistical or parametric analysis in EMI evaluation. This article employs parametric vector-fitting (VF) to analyze the EM coupling effect on microstrip lines in a perforated metallic enclosure. The EM coupling problem is converted into a circuit using Thevenin's equivalent circuit and VF, where a rational function with a common pole represents the transfer function at various incident directions. An intentional EMI source is introduced into the circuit in this way and is treated as a load-independent source. The results obtained from equivalent circuit methods exhibit consistency with those computed by full-wave solver for linear and nonlinear loads, showcasing superior time efficiency. The application of parametric VF in field-to-line coupling can expedite EMI evaluations during the product design phase.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
利用参数矢量拟合加速设计阶段的 IEMI 评估
电磁干扰(EMI)评估是至关重要的第一步:电磁耦合分析。场-线耦合问题要求电磁问题和相关电路的自一致解。有效预测电路响应对于电磁干扰评估中的统计或参数分析至关重要。本文采用参数向量拟合(VF)方法分析了穿孔金属外壳中微带线的电磁耦合效应。利用Thevenin等效电路和VF将电磁耦合问题转化为电路,其中具有共极的有理函数表示在各个入射方向上的传递函数。有意的电磁干扰源以这种方式引入电路,并被视为负载无关源。等效电路法计算结果与全波解算器计算结果一致,具有较好的时间效率。参数化VF在场线耦合中的应用可以加快产品设计阶段的电磁干扰评估。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
期刊最新文献
Electromagnetic Susceptibility of Programmable Integrated Circuits Output: From Transistor to System EMI Reduction Method for Wireless Power Transfer Using Broadband Topology and Spread-Spectrum Frequency Modulation Assessing the Probability of Detection in a Frequency-Selective EMD Detector: A Design Perspective GHz Range Surrogate Modeling of Transistor Switching Spectra On the Applicability Conditions of Approximate Measurement Models for Shielding Effectiveness Using Coupled Reverberation Chambers
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1