{"title":"Accelerate IEMI Evaluation in the Design Stage Using Parametric Vector-Fitting","authors":"Mingwen Zhang;Chunguang Ma;Ruilong Song;Yong Luo","doi":"10.1109/TEMC.2024.3453556","DOIUrl":null,"url":null,"abstract":"Electromagnetic interference (EMI) evaluation necessitates a crucial first step: electromagnetic (EM) coupling analysis. The field-to-line coupling problem requires a self-consistent solution of the EM problem and the associated circuit. Efficient prediction of circuit responses is paramount for statistical or parametric analysis in EMI evaluation. This article employs parametric vector-fitting (VF) to analyze the EM coupling effect on microstrip lines in a perforated metallic enclosure. The EM coupling problem is converted into a circuit using Thevenin's equivalent circuit and VF, where a rational function with a common pole represents the transfer function at various incident directions. An intentional EMI source is introduced into the circuit in this way and is treated as a load-independent source. The results obtained from equivalent circuit methods exhibit consistency with those computed by full-wave solver for linear and nonlinear loads, showcasing superior time efficiency. The application of parametric VF in field-to-line coupling can expedite EMI evaluations during the product design phase.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 6","pages":"1868-1875"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10676322/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Electromagnetic interference (EMI) evaluation necessitates a crucial first step: electromagnetic (EM) coupling analysis. The field-to-line coupling problem requires a self-consistent solution of the EM problem and the associated circuit. Efficient prediction of circuit responses is paramount for statistical or parametric analysis in EMI evaluation. This article employs parametric vector-fitting (VF) to analyze the EM coupling effect on microstrip lines in a perforated metallic enclosure. The EM coupling problem is converted into a circuit using Thevenin's equivalent circuit and VF, where a rational function with a common pole represents the transfer function at various incident directions. An intentional EMI source is introduced into the circuit in this way and is treated as a load-independent source. The results obtained from equivalent circuit methods exhibit consistency with those computed by full-wave solver for linear and nonlinear loads, showcasing superior time efficiency. The application of parametric VF in field-to-line coupling can expedite EMI evaluations during the product design phase.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.