Bonding Hierarchy and Coordination Interaction Leading to High Thermoelectricity in Wide Bandgap TlAgI2

Xiaoying Wang, Mengyang Li, Minxuan Feng, Xuejie Li, Yuzhou Hao, Wen Shi, Jiangang He, Xiangdong Ding, Zhibin Gao
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Abstract

High thermoelectric properties are associated with the phonon-glass electron-crystal paradigm. Conventional wisdom suggests that the optimal bandgap of semiconductor to achieve the largest power factor should be between 6 and 10 kbT. To address challenges related to the bipolar effect and temperature limitations, we present findings on Zintl-type TlAgI2, which demonstrates an exceptionally low lattice thermal conductivity of 0.3 W m-1 K-1 at 300 K. The achieved figure of merit (ZT) for TlAgI2, featuring a 1.55 eV bandgap, reaches a value of 2.20 for p-type semiconductor. This remarkable ZT is attributed to the existence of extended antibonding states Ag-I in the valence band. Furthermore, the bonding hierarchy, influencing phonon anharmonicity, and coordination bonds, facilitating electron transfer between the ligand and the central metal ion, significantly contribute to electronic transport. This finding serves as a promising avenue for the development of high ZT materials with wide bandgaps at elevated temperatures.
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导致宽带隙 TlAgI2 具有高热电性的键合层次和配位相互作用
高热电特性与声子-玻璃-电子-晶体范式有关。传统观点认为,要达到最大功率因数,半导体的最佳带隙应在 6 到 10 kbT 之间。为了应对与双极效应和温度限制有关的挑战,我们展示了对 Zintl 型 TlAgI2 的研究结果,该材料在 300 K 时的晶格热导率极低,仅为 0.3 W m-1 K-1。TlAgI2 的优点系数(ZT)为 1.55 eV 带隙,达到了 p 型半导体的 2.20 值。这一显著的 ZT 值归因于价带中存在扩展的反键态 Ag-I。此外,影响声子谐波的成键层次和促进配体与中心金属离子间电子转移的配位键也对电子传输起了重要作用。这一发现为在高温条件下开发具有宽带隙的高 ZT 材料提供了前景广阔的途径。
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