Preparation and optimization of silicon nitride slurries for digital light processing

Abstract

Digital light processing (DLP) three‐dimensional printing has the advantages of both high printing resolution and efficiency and has been used to manufacture high‐precision, small, and complex shaped ceramic parts. One of the challenges of DLP is to develop photosensitive ceramic slurries with high solid content and low viscosity, especially for non‐oxide ceramics such as silicon nitride due to the dispersion and light absorption problem. This study mainly explores the dispersibility of silicon nitride in ultraviolet (UV)‐cured resins and the photocured properties of the slurry. Rheological measurements were utilized to characterize and screen different dispersants in the resin. It was found that DISPERMP is an effective dispersant. In order to improve the curing depth of Si3N4 photosensitive paste, the surface of silicon nitride powder was treated by oxidation, and organic compounds with different refractive indices were also introduced to increase the light penetration depth. It was found that glycerol with a refractive index of 1.474 resulted in the greatest improvement in the curing depth of Si3N4 photosensitive paste. Finally, a proposed slurry composition was developed to successfully print silicon nitride ceramics through UV‐curing molding technology.