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{"title":"Poly(ether ketone ketone)/hollow silica filler substrates and application for sixth generation communication","authors":"Xing-yu Wei, Zhi-wen Lei, Ning Ma, Tim Hsu, Ya-qiong Huang, Jen-taut Yeh","doi":"10.1002/pi.6690","DOIUrl":null,"url":null,"abstract":"<p>The influence of density and shape of hollow silicas (silica hollow tubes (SHT) or hollow glass microspheres (HGM)) on dielectric and heat-resisting characteristics of poly(ether ketone ketone) (PEKK)/SHT and PEKK/HGM films was systematically investigated. The dielectric characteristics of PEKK/SHT or PEKK/HGM films decrease to a minimum, as their SHT or HGM contents approach 8 or 20 wt%, respectively, and the minimum dielectric constant (<i>ε</i><sub>r</sub>) and dielectric loss (tan <i>δ</i>) of PEKK/SHT or PEKK/HGM films decrease visibly with decreasing SHT densities. By filling with 0.46 g cm<sup>−3</sup> mean density of SHT or HGM fillers, the minimum <i>ε</i><sub>r</sub> and tan <i>δ</i> of PEKK/SHT films are somewhat smaller than those of PEKK/HGM films. The linear coefficient of thermal expansion (LCTE) values of PEKK/SHT or PEKK/HGM films reduce and their onset degradation temperature values increase gradually with increasing SHT and HGM contents. Low <i>ε</i><sub>r</sub>/tan <i>δ</i> (2.11/0.0022 and 2.2/0.0027 at 1 MHz), LCTE (35.5 × 10<sup>−6</sup> and 31.2 × 10<sup>−6</sup> °C<sup>−1</sup>) and excellent heat-resisting properties favorable for sixth generation (6G) ultrarapid communication are realized for appropriately prepared PEKK/SHT and PEKK/HGM substrate films. The free-volume-hole characteristics of PEKK/HGM or PEKK/SHT films approach a maximum as SHT or HGM contents reach an optimum value of 8 or 20 wt%, respectively. © 2024 Society of Chemical Industry.</p>","PeriodicalId":20404,"journal":{"name":"Polymer International","volume":"73 12","pages":"1071-1080"},"PeriodicalIF":2.9000,"publicationDate":"2024-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymer International","FirstCategoryId":"92","ListUrlMain":"https://onlinelibrary.wiley.com/doi/10.1002/pi.6690","RegionNum":4,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"POLYMER SCIENCE","Score":null,"Total":0}
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Abstract
The influence of density and shape of hollow silicas (silica hollow tubes (SHT) or hollow glass microspheres (HGM)) on dielectric and heat-resisting characteristics of poly(ether ketone ketone) (PEKK)/SHT and PEKK/HGM films was systematically investigated. The dielectric characteristics of PEKK/SHT or PEKK/HGM films decrease to a minimum, as their SHT or HGM contents approach 8 or 20 wt%, respectively, and the minimum dielectric constant (ε r ) and dielectric loss (tan δ ) of PEKK/SHT or PEKK/HGM films decrease visibly with decreasing SHT densities. By filling with 0.46 g cm−3 mean density of SHT or HGM fillers, the minimum ε r and tan δ of PEKK/SHT films are somewhat smaller than those of PEKK/HGM films. The linear coefficient of thermal expansion (LCTE) values of PEKK/SHT or PEKK/HGM films reduce and their onset degradation temperature values increase gradually with increasing SHT and HGM contents. Low ε r /tan δ (2.11/0.0022 and 2.2/0.0027 at 1 MHz), LCTE (35.5 × 10−6 and 31.2 × 10−6 °C−1 ) and excellent heat-resisting properties favorable for sixth generation (6G) ultrarapid communication are realized for appropriately prepared PEKK/SHT and PEKK/HGM substrate films. The free-volume-hole characteristics of PEKK/HGM or PEKK/SHT films approach a maximum as SHT or HGM contents reach an optimum value of 8 or 20 wt%, respectively. © 2024 Society of Chemical Industry.
聚醚酮酮/中空二氧化硅填料基材及在第六代通信中的应用
系统研究了空心二氧化硅(二氧化硅空心管(SHT)或空心玻璃微球(HGM))的密度和形状对聚(醚酮酮)(PEKK)/SHT 和 PEKK/HGM 薄膜介电和耐热特性的影响。随着 SHT 或 HGM 含量分别接近 8 或 20 wt%,PEKK/SHT 或 PEKK/HGM 薄膜的介电特性降至最低,并且 PEKK/SHT 或 PEKK/HGM 薄膜的最小介电常数(εr)和介电损耗(tan δ)随着 SHT 密度的降低而明显降低。通过填充平均密度为 0.46 g cm-3 的 SHT 或 HGM 填料,PEKK/SHT 薄膜的最小值 εr 和 tan δ 比 PEKK/HGM 薄膜略小。随着 SHT 和 HGM 含量的增加,PEKK/SHT 或 PEKK/HGM 薄膜的线性热膨胀系数(LCTE)值降低,开始降解温度值逐渐升高。适当制备的 PEKK/SHT 和 PEKK/HGM 基底薄膜具有低 εr/tan δ(2.11/0.0022 和 2.2/0.0027,1 MHz 时)、LCTE(35.5 × 10-6 和 31.2 × 10-6 ℃-1)和优异的耐热性能,有利于第六代(6G)超高速通信。当 SHT 或 HGM 含量分别达到 8 或 20 wt% 的最佳值时,PEKK/HGM 或 PEKK/SHT 薄膜的自由体积孔特性接近最大值。© 2024 化学工业协会。
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