Deep Neural Network-Based Temperature Mapping Technique for Heat Sink on Electronic Devices Using Local Thermocouple Sensors

IF 2.9 4区 计算机科学 Q2 COMPUTER SCIENCE, ARTIFICIAL INTELLIGENCE Applied Artificial Intelligence Pub Date : 2024-08-12 DOI:10.1080/08839514.2024.2389374
Jaehee Shin, Hyun Ahn, Gwang-Hyeon Mun, Jeongmin Lee, Pouria Zaghari, Young-Min Park, Jinhyoung Park, Jong Eun Ryu, Dong-Won Jang
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Abstract

Heat generated by electronic devices can lead to thermal deformation, damage, and fatigue failure, underscoring the importance of monitoring heat distribution. This study introduces an artificial n...
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基于深度神经网络的电子设备散热器温度映射技术(使用本地热电偶传感器
电子设备产生的热量会导致热变形、损坏和疲劳失效,这凸显了监测热量分布的重要性。本研究引入了一种人工...
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来源期刊
Applied Artificial Intelligence
Applied Artificial Intelligence 工程技术-工程:电子与电气
CiteScore
5.20
自引率
3.60%
发文量
106
审稿时长
6 months
期刊介绍: Applied Artificial Intelligence addresses concerns in applied research and applications of artificial intelligence (AI). The journal also acts as a medium for exchanging ideas and thoughts about impacts of AI research. Articles highlight advances in uses of AI systems for solving tasks in management, industry, engineering, administration, and education; evaluations of existing AI systems and tools, emphasizing comparative studies and user experiences; and the economic, social, and cultural impacts of AI. Papers on key applications, highlighting methods, time schedules, person-months needed, and other relevant material are welcome.
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