Recent progress of laser processing technology in micro-LED display manufacturing: A review

Lingxiao Song, Xuechao Yong, Peilei Zhang, Shijie Song, Kefan Chen, Hua Yan, Tianzhu Sun, Qinghua Lu, Haichuan Shi, Yu Chen, Yuze Huang
{"title":"Recent progress of laser processing technology in micro-LED display manufacturing: A review","authors":"Lingxiao Song, Xuechao Yong, Peilei Zhang, Shijie Song, Kefan Chen, Hua Yan, Tianzhu Sun, Qinghua Lu, Haichuan Shi, Yu Chen, Yuze Huang","doi":"10.1016/j.optlastec.2024.111710","DOIUrl":null,"url":null,"abstract":"Micro-LED undoubtedly stands out as a highly anticipated technology when it comes to the innovation of future display technologies. Micro-LED technology surpasses traditional display technologies regarding color representation, energy efficiency, and flexibility by individually assembling tiny light-emitting diodes on a substrate. Micro-LED technology, a further evolution of LED, is considered the most promising next-generation display technology due to its outstanding brightness, high contrast ratio, and extremely high pixel density. The application of laser technology in Micro-LED displays is increasingly becoming a focus of research and industry. As a highly integrated light source, lasers offer unique advantages in Micro-LED applications, including high-energy density processing, non-contact processing, precise microstructure processing and sculpting capability, efficient packaging, and improved device quality and reliability. These advantages provide a distinctive edge in achieving high-precision manufacturing and assembly of Micro-LED chips. Laser epitaxy substrate technology utilizes laser heating and material deposition to grow Micro-LED chips on a substrate. Laser etching technology achieves precise control of lasers to enable microstructure processing and sculpting of Micro-LED devices. Laser lift-off technology utilizes laser-induced decomposition of GaN to peel off the underlying material, allowing for the separation of Micro-LEDs. Laser-based massive transfer technology uses the energy of lasers to swiftly and accurately transfer Micro-LEDs from the substrate to the target substrate, enabling rapid device transfer. Lastly, laser repair technology is employed for the detection and repair of potential defects in Micro-LEDs, enhancing device quality and reliability. By utilizing lasers, we can expect to achieve higher production efficiency, more precise device manufacturing, and superior optoelectronic performance in the field of Micro-LED, thereby presenting broader prospects for future display technology and lighting applications. These laser technologies provide new solutions for Micro-LED devices’ high-precision and high-efficiency production.","PeriodicalId":19597,"journal":{"name":"Optics & Laser Technology","volume":"11 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optics & Laser Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1016/j.optlastec.2024.111710","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Micro-LED undoubtedly stands out as a highly anticipated technology when it comes to the innovation of future display technologies. Micro-LED technology surpasses traditional display technologies regarding color representation, energy efficiency, and flexibility by individually assembling tiny light-emitting diodes on a substrate. Micro-LED technology, a further evolution of LED, is considered the most promising next-generation display technology due to its outstanding brightness, high contrast ratio, and extremely high pixel density. The application of laser technology in Micro-LED displays is increasingly becoming a focus of research and industry. As a highly integrated light source, lasers offer unique advantages in Micro-LED applications, including high-energy density processing, non-contact processing, precise microstructure processing and sculpting capability, efficient packaging, and improved device quality and reliability. These advantages provide a distinctive edge in achieving high-precision manufacturing and assembly of Micro-LED chips. Laser epitaxy substrate technology utilizes laser heating and material deposition to grow Micro-LED chips on a substrate. Laser etching technology achieves precise control of lasers to enable microstructure processing and sculpting of Micro-LED devices. Laser lift-off technology utilizes laser-induced decomposition of GaN to peel off the underlying material, allowing for the separation of Micro-LEDs. Laser-based massive transfer technology uses the energy of lasers to swiftly and accurately transfer Micro-LEDs from the substrate to the target substrate, enabling rapid device transfer. Lastly, laser repair technology is employed for the detection and repair of potential defects in Micro-LEDs, enhancing device quality and reliability. By utilizing lasers, we can expect to achieve higher production efficiency, more precise device manufacturing, and superior optoelectronic performance in the field of Micro-LED, thereby presenting broader prospects for future display technology and lighting applications. These laser technologies provide new solutions for Micro-LED devices’ high-precision and high-efficiency production.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
微型 LED 显示屏制造中激光加工技术的最新进展:综述
Micro-LED 无疑是未来显示技术创新中备受瞩目的一项技术。Micro-LED 技术通过在基板上单独组装微型发光二极管,在色彩表现、能效和灵活性方面超越了传统显示技术。Micro-LED 技术是 LED 的进一步发展,因其出色的亮度、高对比度和极高的像素密度,被认为是最有前途的下一代显示技术。激光技术在 Micro-LED 显示屏中的应用正日益成为研究和产业界的焦点。作为一种高度集成的光源,激光在 Micro-LED 应用中具有独特的优势,包括高能量密度加工、非接触加工、精确的微结构加工和雕刻能力、高效封装以及更高的器件质量和可靠性。这些优势为实现 Micro-LED 芯片的高精度制造和装配提供了独特的优势。激光外延基底技术利用激光加热和材料沉积在基底上生长 Micro-LED 芯片。激光蚀刻技术实现了对激光的精确控制,从而能够对 Micro-LED 器件进行微结构加工和雕刻。激光剥离技术利用激光诱导 GaN 分解来剥离底层材料,从而实现 Micro-LED 的分离。激光大规模转移技术利用激光的能量将 Micro-LED 从基底迅速准确地转移到目标基底,从而实现快速的器件转移。最后,激光修复技术用于检测和修复 Micro-LED 的潜在缺陷,从而提高器件的质量和可靠性。通过利用激光,我们有望在 Micro-LED 领域实现更高的生产效率、更精确的器件制造和更优越的光电性能,从而为未来的显示技术和照明应用带来更广阔的前景。这些激光技术为 Micro-LED 设备的高精度和高效率生产提供了新的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Optical parameter determination in chiral media: Refractive index and Pasteur parameter insights High-brightness low voltage alternative current electroluminescent devices for human wearable displays Silver nanoparticles modified on cicada wings affect fluorescence and Raman signals based on electromagnetic and chemical enhancement mechanisms Heat dissipation enhancement of PiGF converter with vapor chamber radiator for high-brightness laser lighting Modeling of process parameters and wear performance investigation of Inconel 625 nickel-based coatings via laser cladding
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1