Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui
{"title":"6th IBM IEEE CAS/EDS AI Compute Symposium (AICS’23) [CASS Conference Highlights]","authors":"Rajiv Joshi, Matthew Ziegler, Jin-Ping Han, Kaoutar El Maghraoui","doi":"10.1109/mcas.2024.3395580","DOIUrl":null,"url":null,"abstract":"The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.","PeriodicalId":55038,"journal":{"name":"IEEE Circuits and Systems Magazine","volume":"5 1","pages":""},"PeriodicalIF":5.6000,"publicationDate":"2024-08-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Circuits and Systems Magazine","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/mcas.2024.3395580","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The 6th IBM IEEE CAS/EDS AI Compute Symposium was held hybrid at the T. J. Watson Research Center on 28 November 2023. The event was extremely successful and well attended by over 2000 folks from all over the world (in-person and virtual). The symposium featured 8 distinguished speakers (7 from industry and 1 from academia), over 30 student in-person posters, best poster awards, and a panel discussion. The registration list spanned citizens of 53 countries. The theme of the symposium, “From Chips to Chiplets,” turned out to be an opportune and important topic for the current semiconductor industry direction. The symposium served as an educational as well as a brainstorming session for industry/academia/students across the world. The symposium covered a range of topics from emerging device technology, innovative circuits, chip and chiplet architecture, advanced packaging technologies, such as 2D to 3D packaging elements, and how these topics drive the rapid growth of AI and generative AI. Dr. Rajiv Joshi, General Chair and IEEE Life Fellow opened the symposium with welcoming remarks along with the goals and accomplishments of this symposium under the auspices of CAS and IBM.
期刊介绍:
The IEEE Circuits and Systems Magazine covers the subject areas represented by the Society's transactions, including: analog, passive, switch capacitor, and digital filters; electronic circuits, networks, graph theory, and RF communication circuits; system theory; discrete, IC, and VLSI circuit design; multidimensional circuits and systems; large-scale systems and power networks; nonlinear circuits and systems, wavelets, filter banks, and applications; neural networks; and signal processing. Content also covers the areas represented by the Society technical committees: analog signal processing, cellular neural networks and array computing, circuits and systems for communications, computer-aided network design, digital signal processing, multimedia systems and applications, neural systems and applications, nonlinear circuits and systems, power systems and power electronics and circuits, sensors and micromaching, visual signal processing and communication, and VLSI systems and applications. Lastly, the magazine covers the interests represented by the widespread conference activity of the IEEE Circuits and Systems Society. In addition to the technical articles, the magazine also covers Society administrative activities, as for instance the meetings of the Board of Governors, Society People, as for instance the stories of award winners-fellows, medalists, and so forth, and Places reached by the Society, including readable reports from the Society's conferences around the world.