Lightning Transient Impulse Problem of Substation Grounding Grid in Multilayer Horizontal Layered Soil Considering Soil Ionization Effect and Frequency Characteristics

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-09-17 DOI:10.1109/TEMC.2024.3452419
Jian-Bin Fan;Zhong-Xin Li
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Abstract

This study proposes a novel mathematical model based on time-domain Garlerkin's boundary element method. Our approach accurately computes the lightning current distribution and lightning current impulse response of buried grounding grid conductors in horizontal multilayered soil, accounting for soil ionization effects and electrical parameter frequency characteristics. To enhance computational efficiency, we integrate the quasi-static complex image method and its time-domain Green's function closed form into the model. An analytical method is employed to compute the mutual inductance coefficient between the branch currents of any two conductor segments and the mutual resistance between the leakage currents. The proposed Galerkin boundary element method simulates the lightning transient impulse response of substation grounding grids in multilayer horizontal soil.
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考虑土壤电离效应和频率特性的多层水平层土壤中变电站接地网雷电暂态冲击问题
本文提出了一种基于时域Garlerkin边界元法的数学模型。该方法考虑了土壤电离效应和电参数频率特性,准确计算了水平多层土壤中地埋接地网导体的雷击电流分布和雷击电流脉冲响应。为了提高计算效率,我们将拟静态复像方法及其时域格林函数封闭形式集成到模型中。采用解析法计算了任意两导体段支路电流之间的互感系数和泄漏电流之间的互电阻。提出的伽辽金边界元法模拟了多层水平土壤中变电站接地网的雷电瞬态冲击响应。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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