Experimental investigation of edge preparation for cemented carbide profile cutting tools using flexible abrasive jet polishing

IF 6.1 1区 工程技术 Q1 ENGINEERING, MANUFACTURING Journal of Manufacturing Processes Pub Date : 2024-09-18 DOI:10.1016/j.jmapro.2024.09.032
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Abstract

This paper investigates the impact of a novel Flexible Abrasive Jet Polishing (FAJP) method on the edge preparation of profile cutting tools based on Hertz contact theory. FAJP employs flexible rubber particles encapsulating diamond micro-powders as abrasives for air jet polishing. The results indicate a significant improvement in material removal rate with FAJP compared to traditional drag finishing methods, along with superior surface quality near the tool edge. The duration of abrasive usage has the greatest impact on FAJP, depending on the specific requirements of the tool edge, with options ranging from 400 to 200 h. There exists a correlation between jet pressure and jet time, with a recommended jet pressure of 225 kPa, and different coating effects achievable by adjusting the jet time. A tool speed of 280 rpm is recommended.

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利用柔性磨料喷射抛光制备硬质合金成型刀具边缘的实验研究
本文以赫兹接触理论为基础,研究了一种新型柔性磨料喷射抛光(FAJP)方法对成型切削工具边缘制备的影响。FAJP 采用包裹金刚石微粉的柔性橡胶颗粒作为磨料进行喷气抛光。结果表明,与传统的拖拽抛光方法相比,FAJP 能显著提高材料去除率,同时还能提高刀具边缘附近的表面质量。磨料使用时间对 FAJP 的影响最大,这取决于工具边缘的具体要求,可选择 400 到 200 小时不等。喷射压力和喷射时间之间存在相关性,推荐的喷射压力为 225 kPa,通过调整喷射时间可实现不同的涂层效果。建议工具转速为 280 rpm。
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来源期刊
Journal of Manufacturing Processes
Journal of Manufacturing Processes ENGINEERING, MANUFACTURING-
CiteScore
10.20
自引率
11.30%
发文量
833
审稿时长
50 days
期刊介绍: The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.
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