Efficiency and Gain Enhancements of 140 GHz On-Chip Microstrip Patch Antenna Without Enlarged Aperture

IF 4.8 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Antennas and Wireless Propagation Letters Pub Date : 2024-09-13 DOI:10.1109/LAWP.2024.3460980
Si-Yuan Tang;Jixin Chen;Pinpin Yan;Kai Chen;Xiaoyue Xia;Rui Zhou;Long Wang;Peigen Zhou;Jun Xu;Wei Hong
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Abstract

In this letter, a 140 GHz on-chip microstrip patch antenna in 130 nm SiGe BiCMOS is proposed. Limited by the low thickness between the patch and ground plane, the radiation gain and efficiency of the on-chip patch antenna are deteriorated. The defected ground structures (DGSs), which are utilized for bandwidth or isolation improvement in previous works, are introduced to increase the effective profile of the on-chip patch antenna, thus obtaining 1.3 dB gain and 15% efficiency improvements over the conventional on-chip patch antenna. Then, the location and dimension of DGSs are analyzed to develop a design guideline. For experimental validation, a prototype is fabricated and tested, and the measured results show agreement with the simulated one. Most importantly, the proposed antenna has a very simple structure without any off-chip loading components and possesses the same aperture as the conventional on-chip patch antenna.
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无增大孔径的 140 GHz 片上微带贴片天线的效率和增益提升
本文提出了一种130 nm SiGe BiCMOS的140 GHz片上微带贴片天线。片上贴片天线受贴片与地平面厚度较低的限制,导致其辐射增益和效率下降。引入缺陷地结构(dgs),提高片上贴片天线的有效分布,从而获得1.3 dB增益,比传统片上贴片天线效率提高15%。然后,分析了dgs的位置和尺寸,制定了设计指南。为了进行实验验证,制作了样机并进行了测试,测量结果与仿真结果吻合较好。最重要的是,该天线结构非常简单,没有任何片外加载元件,并且具有与传统片上贴片天线相同的孔径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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