A Subtractive Method to Chemically Pattern Liquid Metal for Stretchable Circuits

Kaushal Sumaria, Tingyi “Leo” Liu
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Abstract

Advancements in biomedical research have spurred the development of stretchable electronic devices. While soft insulators are readily available, soft conductors with metal‐like electrical conductivity are rare. Gallium and its alloys, being nontoxic and intrinsically stretchable, are potentially ideal solutions. However, current additive liquid metal (LM) patterning methods face limitations in achieving high‐throughput, high‐resolution, and high‐density LM wiring. Here, a subtractive LM patterning method is developed to meet all these requirements simultaneously. The innovative method involves parallel filling a single continuous microfluidic mesh network with LM that short‐circuits all the pins and pads of a circuit, followed by parallel cutting of the unwanted short‐circuited interconnections using hydrochloric acid (HCl) vapor. Cutting locations are pre‐defined by designing narrower intersecting channels, leveraging capillary force for precise filling and cutting. The process is characterized using a multidimensional parametric study with varying LM line widths and HCl concentrations, and in situ impedance measurements to assess insulation performance. To showcase its high‐throughput capabilities, a mock circuit is used to successfully generate complex LM interconnects that connected hundreds of electrical pads. Finally, a stretchable LM circuit with a micro‐LED array is fabricated to demonstrate the practical application of this technology for massively parallel wiring in stretchable electronics.

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为可拉伸电路绘制液态金属化学图案的减法方法
生物医学研究的进步推动了可拉伸电子设备的发展。虽然软绝缘体很容易获得,但具有类似金属导电性的软导体却很少见。镓及其合金无毒且具有内在可拉伸性,是潜在的理想解决方案。然而,目前的添加型液态金属(LM)图案制作方法在实现高通量、高分辨率和高密度 LM 布线方面存在局限性。在此,我们开发了一种减法液态金属图案化方法,可同时满足所有这些要求。这种创新方法是在单个连续微流体网状网络中并行填充 LM,使电路的所有引脚和焊盘短路,然后使用盐酸 (HCl) 蒸汽并行切割不需要的短路互连。切割位置是通过设计较窄的相交通道预先确定的,利用毛细力进行精确填充和切割。该工艺采用多维参数研究(LM 线宽和盐酸浓度各不相同)和现场阻抗测量来评估绝缘性能。为了展示其高通量能力,使用模拟电路成功生成了连接数百个焊盘的复杂 LM 互连。最后,制作了一个带有微型 LED 阵列的可拉伸 LM 电路,以展示该技术在可拉伸电子器件中大规模并行布线的实际应用。
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