{"title":"Increasing Plane Wave Coupling to a Microstrip on a GTEM Cell Wall in Radiated Susceptibility Measurement","authors":"Adrian T. Sutinjo;Scott Haydon","doi":"10.1109/TEMC.2024.3468270","DOIUrl":null,"url":null,"abstract":"Despite many published studies on coupling of plane wave to a microstrip line, an important special case of incident angle parallel to the ground plane has received much less attention. This special case is essential in radiated immunity testing where the excitation voltage to the device under test (DUT) is delivered through a microstrip line on a printed circuit board mounted on the gigahertz/transverse electromagnetic (GTEM/TEM) cell wall. We point out that the published analytical coupling formula for this special case must be corrected by a factor of 1/2 since in the GTEM/TEM the incident electric field does not double as opposed to that assumed in the infinite ground plane for which the formula was derived. Next, we introduce a method to increase the coupling factor by approximately a factor of two or more by meandering the microstrip, which recovers the value expected from the analytical formula without the 1/2 correction. We demonstrate that the increase of coupling is due to the meander line exhibiting a finite impulse response high-pass filter with increased responses compared to the straight line. Full-wave simulations and GTEM measurements verified our analysis. The meander line permits ample voltage to induce an upset event in a radiated immunity test using a low-cost GTEM 5402-SAE at a modest RF power of 50 W.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"67 2","pages":"693-696"},"PeriodicalIF":2.5000,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electromagnetic Compatibility","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10718728/","RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Despite many published studies on coupling of plane wave to a microstrip line, an important special case of incident angle parallel to the ground plane has received much less attention. This special case is essential in radiated immunity testing where the excitation voltage to the device under test (DUT) is delivered through a microstrip line on a printed circuit board mounted on the gigahertz/transverse electromagnetic (GTEM/TEM) cell wall. We point out that the published analytical coupling formula for this special case must be corrected by a factor of 1/2 since in the GTEM/TEM the incident electric field does not double as opposed to that assumed in the infinite ground plane for which the formula was derived. Next, we introduce a method to increase the coupling factor by approximately a factor of two or more by meandering the microstrip, which recovers the value expected from the analytical formula without the 1/2 correction. We demonstrate that the increase of coupling is due to the meander line exhibiting a finite impulse response high-pass filter with increased responses compared to the straight line. Full-wave simulations and GTEM measurements verified our analysis. The meander line permits ample voltage to induce an upset event in a radiated immunity test using a low-cost GTEM 5402-SAE at a modest RF power of 50 W.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.