{"title":"Reaktionsklebstoffe für die Elektronik","authors":"","doi":"10.1007/s35145-024-1683-x","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":100025,"journal":{"name":"adh?sion KLEBEN & DICHTEN","volume":"68 10","pages":"30 - 33"},"PeriodicalIF":0.0000,"publicationDate":"2024-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"adh?sion KLEBEN & DICHTEN","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1007/s35145-024-1683-x","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
