Estimation of Horizontal Multilayer Soil Parameters Using Bayesian Inference

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-10-17 DOI:10.1109/TEMC.2024.3474182
Min-zhou Liu;Yan-zhao Xie;Zong-yang Wang;Yu-hao Chen
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Abstract

The inversion of earth resistivity structure is of great importance for the calculation of low-frequency electromagnetic interference on ground-based infrastructure. This article presents a Bayesian regression approach for the parameter estimation of horizontal multilayer soils. This supervised learning algorithm can provide more comprehensive statistical properties of soil parameters compared with classical optimization methods. The posterior probability distribution of the soil parameters is inferred by combining their prior knowledge with the measured apparent resistivity from Wenner's method. It allows for statistically quantifying the influence of measurement errors and shielding effects. Furthermore, the optimal number of layers can be distinguished using information criterion, considering both the goodness-of-fit and model complexity. Several multilayer Earth structure cases are used to illustrate the performance of the Bayesian inference method.
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利用贝叶斯推理估算水平多层土壤参数
地电阻率结构反演对于地面基础设施低频电磁干扰计算具有重要意义。本文提出了一种水平多层土参数估计的贝叶斯回归方法。与经典优化方法相比,该算法能够提供更全面的土壤参数统计特性。将土壤参数的先验知识与温纳法测得的视电阻率相结合,推导出土壤参数的后验概率分布。它允许统计量化测量误差和屏蔽效应的影响。在此基础上,结合模型的拟合优度和复杂度,利用信息准则判别最优层数。用几个多层地球结构实例说明了贝叶斯推理方法的性能。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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