A Submodule Insertion Window-Based Capacitor Condition Monitoring Method for Modular Multilevel Converters

IF 5.7 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of Emerging and Selected Topics in Power Electronics Pub Date : 2024-10-23 DOI:10.1109/JESTPE.2024.3485114
Li Zhang;Yihao Liu;Jianhao Zhang;Yue Li
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Abstract

Capacitors are key components of modular multilevel converters (MMCs), and capacitor condition monitoring (CCM) is a crucial issue in MMC. This article introduced a capacitor monitoring method based on submodule (SM) insertion windows to enhance the reliability of the MMC. First, the voltage difference between the reference SM and other SMs is monitored to assess the capacitor condition of the SMs. Second, for the selected SM capacitors in an abnormal state, an insertion window for the SM is extracted by introducing a time delay factor, and the subsequent capacitance calculation is performed based on the voltage changes of the reference SM and other SMs within the monitoring interval. The proposed monitoring method can effectively identify the abnormal capacitor state and accurately calculate the capacitance value. Moreover, the proposed method does not affect the normal operation of the MMC. Finally, simulation analysis and experimental validation are performed to verify the effectiveness of the proposed method.
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基于子模块插入窗口的模块化多电平转换器电容器状态监测方法
电容器是模块式多电平变换器的关键部件,电容器状态监测是模块式多电平变换器的关键问题。本文介绍了一种基于子模块插入窗口的电容监测方法,以提高MMC的可靠性。首先,监测参考SM和其他SM之间的电压差,以评估SM的电容器状况。其次,对选择的处于异常状态的SM电容器,通过引入延时因子提取SM的插入窗口,并根据参考SM和其他SM在监测间隔内的电压变化进行后续电容计算。所提出的监测方法能够有效地识别电容器的异常状态,准确地计算出电容值。此外,所提出的方法不影响MMC的正常运行。最后进行了仿真分析和实验验证,验证了所提方法的有效性。
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来源期刊
CiteScore
12.50
自引率
9.10%
发文量
547
审稿时长
3 months
期刊介绍: The aim of the journal is to enable the power electronics community to address the emerging and selected topics in power electronics in an agile fashion. It is a forum where multidisciplinary and discriminating technologies and applications are discussed by and for both practitioners and researchers on timely topics in power electronics from components to systems.
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