Guangsheng Deng;Linjie Wang;Jing Sun;Jun Yang;Zhiping Yin;Ying Li;Wenbing Zhang;Zelun Li
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引用次数: 0
Abstract
In this article, an ultrabroadband electromagnetic wave absorber with wide angular stability is proposed. The absorber matrix is formed by multilayers of foams and resistive films with different patterns, and two dielectric matching layers are superimposed on the surface of the absorber to improve the absorption effect of the absorber in the case of oblique incidences. Simulations show that the absorptivity of the proposed design reaches more than 90% in the frequency range of 4.0–50.9 GHz, with a relative absorption bandwidth of 171%. In addition, when the incidence angle reaches 60°, the absorber absorbs more than 90% within the frequency band of 15.3–47.3 GHz and 11.3–52 GHz when transverse electric (TE-) and tra nsverse magnetic TM-polarized waves are incident, respectively. The broadband absorption mechanism of the absorber and the role of the dielectric matching layers on the stability of oblique incidence are analyzed, and samples are prepared and tested to validate the design. The ultra-broadband absorbing bandwidth and wide angular stability make the absorber potentially useful for energy absorption and radar scattering cross section reduction applications.
期刊介绍:
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.