Digital Image Correlation Analysis of Fatigue Degradation of Layered Polymer Composites (Polyetheretherketone/Polyetherimide, PEEK/PEI) with Carbon-Fiber Fabric Prepreg
S. V. Panin, A. A. Bogdanov, V. O. Aleksenko, S. A. Bochkareva, P. S. Lyubutin, I. L. Panov, D. Tian
{"title":"Digital Image Correlation Analysis of Fatigue Degradation of Layered Polymer Composites (Polyetheretherketone/Polyetherimide, PEEK/PEI) with Carbon-Fiber Fabric Prepreg","authors":"S. V. Panin, A. A. Bogdanov, V. O. Aleksenko, S. A. Bochkareva, P. S. Lyubutin, I. L. Panov, D. Tian","doi":"10.1134/S1029959924050047","DOIUrl":null,"url":null,"abstract":"<p>In this work, the relationship was considered between the structure and cyclic loading resistance of a layered composite consisting of PEI (PEEK) plate/PEI (PEEK) film/PEI-impregnated carbon-fiber fabric prepreg/PEI (PEEK) film/PEI (PEEK) plate by analyzing the time variation in the parameters of mechanical hysteresis loops calculated using digital image correlation. It was shown that the polyetherimide-based layered composite has low fatigue life under cyclic loading (0.8 of the yield strength), resulting from incompatible deformation between the PEI plates and the prepreg due to a layer interface formed by low-melting TecaPEI film. In the PEEK layered composite, the layer interface was formed by neat PEEK energy director and therefore had a little amount of defects, due to which the load was well transferred from the PEEK plates to the middle reinforcement layer. As a result, the fatigue life at a load level of 0.8 of the yield strength corresponded to high-cycle fatigue (more than 86000 cycles).</p>","PeriodicalId":726,"journal":{"name":"Physical Mesomechanics","volume":"27 5","pages":"541 - 555"},"PeriodicalIF":1.8000,"publicationDate":"2024-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://link.springer.com/content/pdf/10.1134/S1029959924050047.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Physical Mesomechanics","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1134/S1029959924050047","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, the relationship was considered between the structure and cyclic loading resistance of a layered composite consisting of PEI (PEEK) plate/PEI (PEEK) film/PEI-impregnated carbon-fiber fabric prepreg/PEI (PEEK) film/PEI (PEEK) plate by analyzing the time variation in the parameters of mechanical hysteresis loops calculated using digital image correlation. It was shown that the polyetherimide-based layered composite has low fatigue life under cyclic loading (0.8 of the yield strength), resulting from incompatible deformation between the PEI plates and the prepreg due to a layer interface formed by low-melting TecaPEI film. In the PEEK layered composite, the layer interface was formed by neat PEEK energy director and therefore had a little amount of defects, due to which the load was well transferred from the PEEK plates to the middle reinforcement layer. As a result, the fatigue life at a load level of 0.8 of the yield strength corresponded to high-cycle fatigue (more than 86000 cycles).
期刊介绍:
The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.