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IF 2 3区计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-10-28 DOI:10.1109/TEMC.2024.3464309

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来源期刊

IEEE Transactions on Electromagnetic Compatibility 工程技术-电信学

CiteScore

4.80

自引率

19.00%

发文量

235

审稿时长

2.3 months

期刊介绍： IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.

期刊最新文献

Design and Development of a Bounded-Wave High-Altitude Electromagnetic Pulse Simulator Incorporating Self-Steepening Marx Generator and Antenna Integrated Pulse-Shaping Switch On the Correct Approach to the Modeling and Analysis of Quantitative EMC Proficiency Testing Data for the Purpose of Evaluating Test Laboratory Claims of Competency Transient Modeling of High-Speed Links Using Transfer Learning-Based Neural Network Initialization UWB Far-End Crosstalk Mitigation With “LL” Shaped Defected Tabbed Routing Structures Detection and Suppression of Intentional EMI Attacks to Smart Speakers