Evaluating copper plating process for filling micro vias with thin surface Cu by the 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole additive

Abstract

The 1-(4-carboxyphenyl)-5-mercapto-1 h-tetrazole (CMHT) as a novel leveler for the overfilling of micro-blind vias was investigated in acidic copper electroplating. The synergistic effect between CMHT and other additives were confirmed through chronoamperometry, cyclic voltammetry and electrochemical impedance spectroscopy. The results showed a convection-dependent interaction between the CMHT and suppressor (propyleneoxide (PO)-ethylene oxide (EO)-propylene oxide (PO), named PEP). Metallographic section testing demonstrated that the CMHT not only have excellent microvia filling performances, but also only have 19.1 μm thin surface Cu for micro blind vias with a diameter of 150 µm and a depth of 80 µm by the electrodepositing 60 min of 2 A/dm². The quantum chemical calculations experiments revealed also that the CMHT parallel orientation of the benzene ring and tetrazole heterocycle can enhance the effective adsorption area. The obtained results from electrochemical test and quantum chemical calculations were in reasonably good agreement.