Semitopological Expansion for Link Decomposition Analysis

IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-10-29 DOI:10.1109/TEMC.2024.3463398
Wenzhi Wang;Xiaoning Ye
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Abstract

Link decomposition is useful for assessing the contribution of each component to a link's overall signal integrity metrics, aiding engineers in prioritizing components for design optimization or failure analysis. This article presents a new approach for decomposition analysis based on semitopological expansion. Compared with perturbation-based decomposition methods, semitopological expansion proves suitable for decomposing not only insertion loss and crosstalk but also return loss, yielding results with clearer physical significance. Compared with another approach relying on Mason's rule, semitopological expansion exhibits lower computational complexity, rendering it more suitable for handling complex links in practical applications. These advantages are demonstrated through two examples: the decomposition of return loss for a dummy link, and the decomposition of insertion loss and crosstalk for a memory link. The article offers a detailed exposition of the decomposition procedure and demonstrates how the results can be interpreted to identify components critical to the link's signal integrity.
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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