Semitopological Expansion for Link Decomposition Analysis

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-10-29 DOI:10.1109/TEMC.2024.3463398
Wenzhi Wang;Xiaoning Ye
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Abstract

Link decomposition is useful for assessing the contribution of each component to a link's overall signal integrity metrics, aiding engineers in prioritizing components for design optimization or failure analysis. This article presents a new approach for decomposition analysis based on semitopological expansion. Compared with perturbation-based decomposition methods, semitopological expansion proves suitable for decomposing not only insertion loss and crosstalk but also return loss, yielding results with clearer physical significance. Compared with another approach relying on Mason's rule, semitopological expansion exhibits lower computational complexity, rendering it more suitable for handling complex links in practical applications. These advantages are demonstrated through two examples: the decomposition of return loss for a dummy link, and the decomposition of insertion loss and crosstalk for a memory link. The article offers a detailed exposition of the decomposition procedure and demonstrates how the results can be interpreted to identify components critical to the link's signal integrity.
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链路分解分析的半拓扑扩展
链路分解对于评估每个组件对链路整体信号完整性指标的贡献非常有用,有助于工程师对设计优化或故障分析的组件进行优先排序。本文提出了一种基于半拓扑展开的分解分析新方法。与基于微扰的分解方法相比,半拓扑展开不仅适用于插入损失和串扰的分解,也适用于回波损失的分解,所得结果具有更清晰的物理意义。与另一种基于Mason规则的方法相比,半拓扑展开具有较低的计算复杂度,更适合实际应用中处理复杂链路。通过两个例子证明了这些优点:一个是虚拟链路的回波损耗分解,另一个是存储链路的插入损耗和串扰分解。本文提供了分解过程的详细说明,并演示了如何解释结果以识别对链路信号完整性至关重要的组件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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