Finite element modeling for cohesive/adhesive failure of adhesive structures with a thermosetting resin

Abstract

In this study, we established a novel method based on the finite element method (FEM) for predicting the strength of adhesive structures. Viscoplasticity, void growth, and cohesive zone model were introduced into the FEM to create a nonlinear damage growth (NDG) model. This model was used to comprehensively analyze the process zones within the adhesive layer. Furthermore, the embedded process zone approach was used to develop an interface constitutive law that averages the mechanical response of the adhesive layer. This modified Ma–Kishimoto (MMK) model can accurately represent the adhesive layer as an interface element and is computationally efficient. Furthermore, the study obtained the necessary interface properties for the MMK model from the NDG model, creating a numerical material test that can approximate the effect of the process zone. To validate the proposed method, single-lap shear tests were performed, and the accuracy of the predicted strength and deformation field was evaluated. The damage evolution in the NDG model and the MMK model were compared, and the scope of application of the MMK model was discussed. The results of this study can be used as a reference for the failure mechanism of thermosetting adhesives and establishment of design indices for adhesive structural strength.