Industrial-grade 2-μm ultrafast fiber laser CPA for silicon processing

Christian Gaida, Tobias Heuermann, Sven Breitkopf, Tino Eidam, Jens Limpert
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Abstract

A novel compact laser utilizing thulium-based fiber chirped-pulse amplification (CPA) technology has been developed to enable essential tasks such as microwelding or the precision cutting of filaments with semiconductors such as silicon. At a central wavelength of 2 μm, the activeTwo-15 provides pulse energies exceeding 100 μJ and an average power output surpassing 15 W, and can be seamlessly integrated into systems for materials processing.

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用于硅加工的工业级 2 微米超快光纤激光器 CPA
利用铥基光纤啁啾脉冲放大(CPA)技术开发的新型紧凑型激光器可用于微焊接或精密切割硅等半导体灯丝等重要任务。activeTwo-15 的中心波长为 2 μm,脉冲能量超过 100 μJ,平均输出功率超过 15 W,可无缝集成到材料加工系统中。
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Calendar SiC high-tech ceramics — a comparison of laser processes Ultraviolet line structuring of large solar wafers Raman spectroscopy and imaging in bio and life sciences Industrial-grade 2-μm ultrafast fiber laser CPA for silicon processing
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