{"title":"A 1920 × 1080 Array 2-D/3-D Image Sensor With 3-μ s Row-Time Single-Slope ADC and 100-MHz Demodulated PPD Locked-In Pixel","authors":"Quanmin Chen;Kaiming Nie;Jing Gao;Xiaoyu Zhang;Jiangtao Xu","doi":"10.1109/JSSC.2024.3487196","DOIUrl":null,"url":null,"abstract":"This article presents a <inline-formula> <tex-math>$1920{\\times } 1080$ </tex-math></inline-formula> array 2-D/3-D image sensor with 3-<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula> s row-time single-slope ADC (SSADC) and 100-MHz demodulated locked-in pixel. To obtain reliable depth information, a backside-illuminated <inline-formula> <tex-math>$6{\\times } 6~{\\mu }$ </tex-math></inline-formula> m pinned photodiode (PPD) pixel with high built-in electric field is used to accelerate charge transfer. Storage diodes (SDs) are designed to collect demodulated electrons for correlated double sampling (CDS) readout. The two-tap pixel and differential multiplexing readout architecture realize both image modes (2-D and 3-D) working with full-HD resolution. To overcome the limitation of quantization speed in conventional structures, we introduce a 4-bit time-to-digital converter (TDC) into the 8-bit SSADC for residual information quantization, achieving 3-<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula> s row-time and 12-bit readout accuracy. In addition, we have proposed a detection and correction circuit in the data stitching process, which resolves error code problem. The common-mode output of two different taps is removed through full differential readout for the background light (BGL) canceling. A prototype chip is fabricated in a 110-nm backside illumination CMOS image sensor (BSI CIS) process. The designed PPD enabled a low depth noise of under 0.43% over the range of 0.3–1.5 m, with a modulation frequency of 100 MHz. By adopting the high-speed SSADC, the 2-D and 3-D frame rates achieve 300 and 60 frames/s, respectively.","PeriodicalId":13129,"journal":{"name":"IEEE Journal of Solid-state Circuits","volume":"60 6","pages":"2025-2036"},"PeriodicalIF":5.6000,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal of Solid-state Circuits","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10746382/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article presents a $1920{\times } 1080$ array 2-D/3-D image sensor with 3-$\mu $ s row-time single-slope ADC (SSADC) and 100-MHz demodulated locked-in pixel. To obtain reliable depth information, a backside-illuminated $6{\times } 6~{\mu }$ m pinned photodiode (PPD) pixel with high built-in electric field is used to accelerate charge transfer. Storage diodes (SDs) are designed to collect demodulated electrons for correlated double sampling (CDS) readout. The two-tap pixel and differential multiplexing readout architecture realize both image modes (2-D and 3-D) working with full-HD resolution. To overcome the limitation of quantization speed in conventional structures, we introduce a 4-bit time-to-digital converter (TDC) into the 8-bit SSADC for residual information quantization, achieving 3-$\mu $ s row-time and 12-bit readout accuracy. In addition, we have proposed a detection and correction circuit in the data stitching process, which resolves error code problem. The common-mode output of two different taps is removed through full differential readout for the background light (BGL) canceling. A prototype chip is fabricated in a 110-nm backside illumination CMOS image sensor (BSI CIS) process. The designed PPD enabled a low depth noise of under 0.43% over the range of 0.3–1.5 m, with a modulation frequency of 100 MHz. By adopting the high-speed SSADC, the 2-D and 3-D frame rates achieve 300 and 60 frames/s, respectively.
期刊介绍:
The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.