{"title":"A capacitance reduction modulation approach of hybrid modular multilevel converter with boosted modulation index and circulating current injection","authors":"Hongxu Li, Qin Wang, Qunfang Wu, Lan Xiao, Jinbo Li, Qi Chen","doi":"10.1049/pel2.12729","DOIUrl":null,"url":null,"abstract":"<p>In a modular multilevel converter (MMC) system, the sub-module capacitors account for a large proportion of the cost, volume, and weight. This paper proposed a method to reduce the total capacitance of MMC based on the combination of boosting the modulation index (<i>m</i>) and second-harmonic circulating current injection (SCCI). A small amount of full-bridge sub-modules was added to conventional half-bridge sub-modules (HBSM) based MMC to form the hybrid MMC. The third-harmonic voltage injection technology was used to increase the <i>m</i> of hybrid MMC without the common-mode voltage injected on the ac-side. An optimized SCCI method determined by <i>m</i> was introduced, which limited the root mean square (RMS) of arm current. An improved modulation approach is used to eliminate the coupling effect of third-harmonic voltage injection and SCCI in boosting <i>m</i>, ensuring that the <i>m</i> increases to 1.15 with the optimized SCCI. Compared with conventional HBSM-MMC, the proposed method reduced the total capacitance by approximately half when <i>m</i> = 1.15. A comprehensive comparison of different capacitance reduction methods was presented to demonstrate the cost and effect. Simulation and experiment verified the proposed method.</p>","PeriodicalId":56302,"journal":{"name":"IET Power Electronics","volume":"17 14","pages":"1736-1748"},"PeriodicalIF":1.9000,"publicationDate":"2024-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1049/pel2.12729","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IET Power Electronics","FirstCategoryId":"5","ListUrlMain":"https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/pel2.12729","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In a modular multilevel converter (MMC) system, the sub-module capacitors account for a large proportion of the cost, volume, and weight. This paper proposed a method to reduce the total capacitance of MMC based on the combination of boosting the modulation index (m) and second-harmonic circulating current injection (SCCI). A small amount of full-bridge sub-modules was added to conventional half-bridge sub-modules (HBSM) based MMC to form the hybrid MMC. The third-harmonic voltage injection technology was used to increase the m of hybrid MMC without the common-mode voltage injected on the ac-side. An optimized SCCI method determined by m was introduced, which limited the root mean square (RMS) of arm current. An improved modulation approach is used to eliminate the coupling effect of third-harmonic voltage injection and SCCI in boosting m, ensuring that the m increases to 1.15 with the optimized SCCI. Compared with conventional HBSM-MMC, the proposed method reduced the total capacitance by approximately half when m = 1.15. A comprehensive comparison of different capacitance reduction methods was presented to demonstrate the cost and effect. Simulation and experiment verified the proposed method.
期刊介绍:
IET Power Electronics aims to attract original research papers, short communications, review articles and power electronics related educational studies. The scope covers applications and technologies in the field of power electronics with special focus on cost-effective, efficient, power dense, environmental friendly and robust solutions, which includes:
Applications:
Electric drives/generators, renewable energy, industrial and consumable applications (including lighting, welding, heating, sub-sea applications, drilling and others), medical and military apparatus, utility applications, transport and space application, energy harvesting, telecommunications, energy storage management systems, home appliances.
Technologies:
Circuits: all type of converter topologies for low and high power applications including but not limited to: inverter, rectifier, dc/dc converter, power supplies, UPS, ac/ac converter, resonant converter, high frequency converter, hybrid converter, multilevel converter, power factor correction circuits and other advanced topologies.
Components and Materials: switching devices and their control, inductors, sensors, transformers, capacitors, resistors, thermal management, filters, fuses and protection elements and other novel low-cost efficient components/materials.
Control: techniques for controlling, analysing, modelling and/or simulation of power electronics circuits and complete power electronics systems.
Design/Manufacturing/Testing: new multi-domain modelling, assembling and packaging technologies, advanced testing techniques.
Environmental Impact: Electromagnetic Interference (EMI) reduction techniques, Electromagnetic Compatibility (EMC), limiting acoustic noise and vibration, recycling techniques, use of non-rare material.
Education: teaching methods, programme and course design, use of technology in power electronics teaching, virtual laboratory and e-learning and fields within the scope of interest.
Special Issues. Current Call for papers:
Harmonic Mitigation Techniques and Grid Robustness in Power Electronic-Based Power Systems - https://digital-library.theiet.org/files/IET_PEL_CFP_HMTGRPEPS.pdf