MANTIS: A Mixed-Signal Near-Sensor Convolutional Imager SoC Using Charge-Domain 4b-Weighted 5-to-84-TOPS/W MAC Operations for Feature Extraction and Region-of-Interest Detection

IF 5.6 1区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Journal of Solid-state Circuits Pub Date : 2024-11-11 DOI:10.1109/JSSC.2024.3484766
Martin Lefebvre;David Bol
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Abstract

Recent advances in artificial intelligence (AI) have prompted the search for enhanced algorithms and hardware to support the deployment of machine learning (ML) at the edge. More specifically, in the context of the Internet of Things (IoT), vision chips must be able to fulfill the tasks of low to medium complexity, such as feature extraction (FE) or region-of-interest (RoI) detection, with a sub-mW power budget imposed by the use of small batteries or energy harvesting. Mixed-signal vision chips relying on in- or near-sensor processing have emerged as an interesting candidate because of their favorable tradeoff between energy efficiency (EE) and computational accuracy compared with digital systems for these specific tasks. In this article, we introduce a mixed-signal convolutional imager system-on-chip (SoC) codenamed MANTIS, featuring a unique combination of large $16{\times }16~4$ b-weighted filters, operation at multiple scales, and double sampling, well suited to the requirements of medium-complexity tasks. The main contributions are (i) circuits called DS3 units combining delta-reset sampling (DRS), image downsampling (DS), and voltage downshifting and (ii) charge-domain multiply-and-accumulate (MAC) operations based on switched-capacitor (SC) amplifiers and charge sharing in the capacitive DAC of the successive-approximation (SAR) ADCs, MANTIS achieves peak EEs normalized to 1b operations of 4.6 and 84.1 TOPS/W at the accelerator and SoC levels, while computing feature maps (fmaps) with a root-mean-square error (RMSE) ranging from 3 to 11.3%. It also demonstrates a face RoI detection with a false negative rate (FNR) of 11.5%, while discarding 81.3% of image patches and reducing the data transmitted off chip by $13{\times }$ compared with the raw image.
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MANTIS:混合信号近传感器卷积成像仪 SoC,使用电荷域 4b 加权 5 至 84-TOPS/W MAC 运算进行特征提取和兴趣区域检测
人工智能(AI)的最新进展促使人们寻求增强的算法和硬件,以支持在边缘部署机器学习(ML)。更具体地说,在物联网(IoT)的背景下,视觉芯片必须能够完成低到中等复杂性的任务,例如特征提取(FE)或感兴趣区域(RoI)检测,并且使用小型电池或能量收集所施加的功率预算低于mw。依靠内传感器或近传感器处理的混合信号视觉芯片已经成为一个有趣的候选,因为与数字系统相比,它们在这些特定任务的能源效率(EE)和计算精度之间取得了有利的权衡。在本文中,我们介绍了一种代号为MANTIS的混合信号卷积成像仪片上系统(SoC),具有大$16{\times}16~4$ b加权滤波器,多尺度操作和双重采样的独特组合,非常适合中等复杂任务的要求。主要贡献是(i) DS3单元电路,结合了delta复位采样(DRS)、图像下采样(DS)和电压下移;(ii)基于开关电容(SC)放大器和连续近似(SAR) adc的电容DAC中的电荷共享的电荷域乘法和累积(MAC)操作,MANTIS在加速器和SoC水平上实现了归一化到1b的峰值EEs,分别为4.6和84.1 TOPS/W。同时计算特征图(fmaps),其均方根误差(RMSE)在3%到11.3%之间。它还展示了假阴性率(FNR)为11.5%的人脸RoI检测,同时丢弃了81.3%的图像补丁,与原始图像相比,芯片外传输的数据减少了13倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Journal of Solid-state Circuits
IEEE Journal of Solid-state Circuits 工程技术-工程:电子与电气
CiteScore
11.00
自引率
20.40%
发文量
351
审稿时长
3-6 weeks
期刊介绍: The IEEE Journal of Solid-State Circuits publishes papers each month in the broad area of solid-state circuits with particular emphasis on transistor-level design of integrated circuits. It also provides coverage of topics such as circuits modeling, technology, systems design, layout, and testing that relate directly to IC design. Integrated circuits and VLSI are of principal interest; material related to discrete circuit design is seldom published. Experimental verification is strongly encouraged.
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