Mechanisms for Unwanted Magnetic Field Coupling to a Shielded Magnetic Near-Field Probe

IF 2.5 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Transactions on Electromagnetic Compatibility Pub Date : 2024-11-13 DOI:10.1109/TEMC.2024.3486170
Xin Yan;Wei Zhang;Sajjad Sadeghi;Mehdi Gholizadeh;David J. Pommerenke;Daryl G. Beetner
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Abstract

Unwanted field coupling is a major concern when using magnetic near-field probes for high-frequency scanning. The unwanted coupling of the tangential electric field to a tangential magnetic field probe has been studied extensively. This article shows a second unwanted coupling mechanism: coupling from a vertical magnetic field. The standing wave of a shorted pure TEM microstrip in air is utilized to separate the magnetic and electric field coupling. Simulations show that the eddy currents induced within the probe by the vertical magnetic field couple inductively to the pickup loop if the layer stack up is not symmetric. The unwanted magnetic field coupling mechanism is validated through both simulation and measurement. Two improved designs are proposed to mitigate the impact.
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屏蔽磁性近场探头的无用磁场耦合机制
当使用磁场近场探头进行高频扫描时,不需要的场耦合是一个主要问题。切向电场与切向磁场探针之间的非期望耦合已被广泛研究。本文展示了第二种不需要的耦合机制:垂直磁场的耦合。利用纯瞬变电磁法微带在空气中的驻波分离磁场和电场耦合。仿真结果表明,在非对称叠层情况下,垂直磁场在探头内产生的涡流与拾取环产生电感耦合。通过仿真和测量验证了非期望磁场耦合机理。提出了两种改进设计来减轻影响。
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来源期刊
CiteScore
4.80
自引率
19.00%
发文量
235
审稿时长
2.3 months
期刊介绍: IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
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